A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.

The technical problems to be solved are to keep the vicinity of the nozzle opening clean and to restrain the jet liquid column from tilting. The solution to problems lies in a method for cleaning a nozzle of a laser machining apparatus to process a work piece to be processed by a laser beam introduced into a jet liquid column, the method comprising the steps of: forming the jet liquid column by jetting a liquid from the nozzle; and irradiating a spot 30 of the laser beam onto a vicinal section of an inlet opening 22c of the nozzle in such a state that a peak power per unit area of the spot 30 of the laser beam irradiated on a surface provided with the inlet opening 22c of the nozzle does not go beyond a threshold value at which the nozzle is damaged and removing foreign matters attached on the surface.

The technical problems to be solved are to keep the vicinity of the nozzle opening clean and to restrain the jet liquid column from tilting. The solution to problems lies in a method for cleaning a nozzle of a laser machining apparatus to process a work piece to be processed by a laser beam introduced into a jet liquid column, the method comprising the steps of: forming the jet liquid column by jetting a liquid from the nozzle; and irradiating a spot 30 of the laser beam onto a vicinal section of an inlet opening 22c of the nozzle in such a state that a peak power per unit area of the spot 30 of the laser beam irradiated on a surface provided with the inlet opening 22c of the nozzle does not go beyond a threshold value at which the nozzle is damaged and removing foreign matters attached on the surface.

The invention relates to a material feeding device. The material feeding device according to the invention to be used in a material processing device has a material feeding channel with an output end facing a processing site during operation of the material feeding device, and is characterized in that the material feeding device has at least one microchannel.

A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.

A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.

The present disclosure relates to the field of Chemical Vapor Deposition (CVD) diamonds and their processing after fabrication. In particular, the present disclosures provides a method for coring and slicing a CVD diamond product, wherein the CVD diamond product comprises a CVD diamond and graphitized material covering several side-faces of the diamond. The method is carried out by an apparatus that provides a laser beam coupled into a fluid jet. The method comprises, for the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond. Further, the method comprises, for the slicing, cutting off one or more slices from the diamond with the laser beam.

A waterjet-guided laser machine includes a laser source, an LED, a waterjet head, and a light sensor. The waterjet head includes a water inlet and a nozzle having an outlet for a discharging a waterjet. There is a laser optical path along which a pulsed laser beam travels to the nozzle outlet. There is also a light beam optical delivery path along which the light beam travels from the LED to the nozzle outlet. The light beam optical delivery path is coincident with the laser optical path in the nozzle. There is a light beam optical return path along which the light beam that is reflected off of a workpiece travels to the light sensor. The light beam optical return path is coincident with the laser optical path inside the nozzle and coincident with the light beam optical delivery path inside the nozzle.

A waterjet-guided laser machine includes a laser source, an LED, a waterjet head, and a light sensor. The waterjet head includes a water inlet and a nozzle having an outlet for a discharging a waterjet. There is a laser optical path along which a pulsed laser beam travels to the nozzle outlet. There is also a light beam optical delivery path along which the light beam travels from the LED to the nozzle outlet. The light beam optical delivery path is coincident with the laser optical path in the nozzle. There is a light beam optical return path along which the light beam that is reflected off of a workpiece travels to the light sensor. The light beam optical return path is coincident with the laser optical path inside the nozzle and coincident with the light beam optical delivery path inside the nozzle.