A method of operating an apparatus for laser annealing, includes reducing temporal or spatial coherency of a plurality of laser beams by beam superimposing; and reducing an electric field inner product magnitude of beams having the reduced temporal or spatial coherency by a fly eye lens array to reduce coherency, and/or by modifying a polarization state between the beams by beam superimposing.

A decorative part and a method for producing a decorative part, wherein the decorative part is in particular a lining part of a motor vehicle. The decorative part has a decorative coat which is provided on the rear side with a reinforcing layer and/or on the visible side with a transparent coating. In order to improve the durability or the optical properties, in particular, of a decorative part provided with a light guide for transilluminating and/or backlighting the decorative coat, the decorative part is post processed by a laser treatment.

A decorative part and a method for producing a decorative part, wherein the decorative part is in particular a lining part of a motor vehicle. The decorative part has a decorative coat which is provided on the rear side with a reinforcing layer and/or on the visible side with a transparent coating. In order to improve the durability or the optical properties, in particular, of a decorative part provided with a light guide for transilluminating and/or backlighting the decorative coat, the decorative part is post processed by a laser treatment.

The present disclosure is directed towards different embodiments of additively manufacturing and smoothing an AM preform to configure an AM preform for downstream processing (working, forging, and the like).

The present disclosure is directed towards different embodiments of additively manufacturing and smoothing an AM preform to configure an AM preform for downstream processing (working, forging, and the like).

A laser irradiation method of irradiating, with a pulse laser beam, an irradiation object in which an impurity source film is formed on a semiconductor substrate includes: reading fluence per pulse of the pulse laser beam with which a rectangular irradiation region set on the irradiation object is irradiated and the number of irradiation pulses the irradiation region is irradiated, the fluence being equal to or larger than a threshold at or beyond which ablation potentially occurs to the impurity source film when the irradiation object is irradiated with pulses of the pulse laser beam in the irradiation pulse number and smaller than a threshold at or beyond which damage potentially occurs to the surface of the semiconductor substrate; calculating a scanning speed Vdx; and moving the irradiation object at the scanning speed Vdx relative to the irradiation region while irradiating the irradiation region with the pulse laser beam at the repetition frequency f.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Various aspects of the present disclosure are directed toward utilizing pulsed laser light to melt and displace material along a surface. As may be consistent with one or more embodiments, material at respective regions of a surface is melted and displaced using pulsed laser light. The melting and displacement at different ones of the regions is carried out to facilitate different displacement at each region. Such an approach may be used by varying characteristics, such as fluence, of the pulsed laser light at each region. In this contexts, surfaces can be smoothed, and structures can be formed on the surface.

Various aspects of the present disclosure are directed toward utilizing pulsed laser light to melt and displace material along a surface. As may be consistent with one or more embodiments, material at respective regions of a surface is melted and displaced using pulsed laser light. The melting and displacement at different ones of the regions is carried out to facilitate different displacement at each region. Such an approach may be used by varying characteristics, such as fluence, of the pulsed laser light at each region. In this contexts, surfaces can be smoothed, and structures can be formed on the surface.

Disclosed is a method for preparing a high-flatness metal foil suitable for making a metal mask, and the method comprises the following steps: forming a raw metal coarse foil; rolling the raw metal coarse foil at least once into a high-flatness metal foil; performing, by a heat treatment device, heat treatment processing on the precisely rolled metal foil according to a preset temperature and a preset time; using a tension leveler to perform tension leveling on the rolled and heat-treated metal foil; and obtaining a high-flatness metal foil after completion of the tension leveling and forming a rolled metal foil in a continuous forming process. The resulting metal foil has high flatness and low residual stress, which improves quality and performance of the metal foil and is suitable for the fabrication of fine metal masks.