An automated laser shock peening (LSP) process equipment system for an aero-engine blade, including: a base, where a loading and unloading manipulator, working manipulator, reverse engineering mechanism, coating apparatus, and LSP apparatus are disposed; the loading and unloading manipulator is configured to grab a blade and place it on the reverse engineering mechanism, which includes a reverse engineering instrument and controller that are connected, the instrument can generate three-dimensional digital data of the blade, and the controller generates a working path for coating and LSP according to the data, and transmits the path to the working manipulator; the loading and unloading manipulator places the blade into the pallet, and the working manipulator drives the blade to a corresponding position according to the path. Independent locating and clamping systems of the pallet and the blade and the pallet and the manipulator fix a position of the blade relative to the manipulator.

An automated laser shock peening (LSP) process equipment system for an aero-engine blade, including: a base, where a loading and unloading manipulator, working manipulator, reverse engineering mechanism, coating apparatus, and LSP apparatus are disposed; the loading and unloading manipulator is configured to grab a blade and place it on the reverse engineering mechanism, which includes a reverse engineering instrument and controller that are connected, the instrument can generate three-dimensional digital data of the blade, and the controller generates a working path for coating and LSP according to the data, and transmits the path to the working manipulator; the loading and unloading manipulator places the blade into the pallet, and the working manipulator drives the blade to a corresponding position according to the path. Independent locating and clamping systems of the pallet and the blade and the pallet and the manipulator fix a position of the blade relative to the manipulator.

The invention provides a laser shock processing method for small-hole component with different thickness. In this method, different process parameters are adopted for laser shock processing of small hole members with different thicknesses, and the empirical formula was obtained by statistical analysis of the experimental results, and the empirical formula $I_0=A{e}^{\frac{t}{B}}\frac{{\sigma }_s^2}{Z}$
is the relationship between power density and thickness of small hole members. According to this formula, the power density of laser shock strengthening of orifice member with different thickness is determined, and the selection and determination method of process parameters related to this is put forward. According to this method, reasonable residual compressive stress distribution can be obtained after laser shock strengthening with appropriate technology, and good strengthening effect can be achieved.

The invention provides a laser shock processing method for small-hole component with different thickness. In this method, different process parameters are adopted for laser shock processing of small hole members with different thicknesses, and the empirical formula was obtained by statistical analysis of the experimental results, and the empirical formula $I_0=A{e}^{\frac{t}{B}}\frac{{\sigma }_s^2}{Z}$
is the relationship between power density and thickness of small hole members. According to this formula, the power density of laser shock strengthening of orifice member with different thickness is determined, and the selection and determination method of process parameters related to this is put forward. According to this method, reasonable residual compressive stress distribution can be obtained after laser shock strengthening with appropriate technology, and good strengthening effect can be achieved.

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J) x frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J) x frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

A downhole tool for conveyance within a tubular secured in a wellbore extending into a subterranean formation. The downhole tool includes a sealing material and a laser apparatus operable to cut a slot in the tubular. The downhole tool is operable to provide melted sealing material within the slot.

A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

A surface treatment method includes: a first step of applying a plane wave-shaped shock wave to a workpiece to cause high-density transition to occur in a material structure of the workpiece; and a second step of applying a spherical wave-shaped shock wave or a pressure due to physical contact to the workpiece after the first step for plastic deformation of the workpiece.