The present disclosure is directed towards different embodiments of additively manufacturing and smoothing an AM preform to configure an AM preform for downstream processing (working, forging, and the like).

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Various aspects of the present disclosure are directed toward utilizing pulsed laser light to melt and displace material along a surface. As may be consistent with one or more embodiments, material at respective regions of a surface is melted and displaced using pulsed laser light. The melting and displacement at different ones of the regions is carried out to facilitate different displacement at each region. Such an approach may be used by varying characteristics, such as fluence, of the pulsed laser light at each region. In this contexts, surfaces can be smoothed, and structures can be formed on the surface.

A method for machining a material using a pulsed laser includes introducing a sequence of laser pulses into the material for machining the material, and synchronizing a start of each sequence with a fundamental frequency of the laser. The sequence of laser pulses comprises at least two different sequence elements that are offset from one another in space and time. Each sequence element comprises an individual laser pulse, a specific succession of individual laser pulses, or a burst of laser pulses. Specific sequence element properties are impressed on each sequence element. The sequence element properties comprise a position of the laser focus of a respective sequence element. The position of the laser focus of each sequence element of the sequence is adapted for each sequence element.

The invention discloses a method for preparing an anticorrosive surface layer of a metal material in a marine environment by laser, which belongs to the technical field of laser processing. First, the laser cladding method is used to prepare a cladding surface layer on the surface of the metal material that is not easy to undergo chemical substitution reaction with the chlorides (NaCl, MgCl.sub.2 , CaCl.sub.2 etc.) in the seawater. Then, on the surface of the cladding surface layer, ultrafast laser processing is used to form a surface layer with a wetting angle (and water) greater than 90 degrees and with hydrophobic characteristics. The anti-corrosion surface layer obtained by the invention has hydrophobic properties, the high humidity and high salt water vapor and marine organisms in the marine environment are not easy to adhere, and the anti-corrosion surface layer is stable in salt water resistance, and is not easy to undergo chemical substitution reaction with chlorides in seawater (NaCl, MgCl.sub.2 , CaCl.sub.2 etc.), which can achieve high-efficiency anti-corrosion of metal materials in the marine environment.

A firearm having a laser induced friction surface. A method for forming the laser induced friction surface on the firearm may includes the steps of disposing the laser machine adjacent to a component of the firearm, adjusting the laser machine, then applying the laser beam of the laser machine onto a component surface.

A method according to one aspect of the present disclosure is a laser marking method for a powder compact containing metal powder, which includes: a first step of scanning with laser light of first power which is weaker over a predetermined area in a surface of the powder compact, to melt and smooth inside of the predetermined area; and a second step of scanning with laser light of second power which is greater, to form a dot formed of a recess of a predetermined depth at a predetermined location in the predetermined area.

A system may include a powder source; a powder delivery device; an energy delivery device; and a computing device. The computing device may be configured to: control the powder source to deliver metal powder to the powder delivery device; control the powder delivery device to deliver the metal powder to a surface of an abrasive coating; and control the energy delivery device to deliver energy to at least one of the abrasive coating or the metal powder to cause the metal powder to be joined to the abrasive coating.

A system may include a powder source; a powder delivery device; an energy delivery device; and a computing device. The computing device may be configured to: control the powder source to deliver metal powder to the powder delivery device; control the powder delivery device to deliver the metal powder to a surface of an abrasive coating; and control the energy delivery device to deliver energy to at least one of the abrasive coating or the metal powder to cause the metal powder to be joined to the abrasive coating.

A method of making a cutting element for use on an earth-boring tool may include forming the cutting element including a cutting table formed from a superabrasive polycrystalline material. The method may further include polishing a cutting surface of the cutting table by pulsing a laser onto the cutting surface of the cutting table. The cutting element may include a superabrasive polycrystalline cutting table including a cutting surface substantially free of micro-anomalies in the superabrasive material.