A pulsed laser printing module for a contact lens, comprises a steel mold, a pulsed laser device and a forming case. The steel mold is configured for transferring pigment. The pulsed laser device is configured for transmitting ultrashort laser pulses having pulse time widths less than 10.sup.−9 seconds. The ultrashort laser pulses etch the surface of the steel mold to remove a coating of the steel mold to form an etched layer. The forming case has a lower member and an upper member. The lower member is a concavity, and an inner surface of the lower member is provided with a lower curved surface. The upper member is provided with a protrusion corresponding to the lower member, and an outer surface of the protrusion is provided with an upper curved surface corresponding to the lower curved surface. The protrusion is capable of being placed in a concavity of the lower member to form a gap between the lower curved surface and the upper curved surface.

A pulsed laser printing module for a contact lens, comprises a steel mold, a pulsed laser device and a forming case. The steel mold is configured for transferring pigment. The pulsed laser device is configured for transmitting ultrashort laser pulses having pulse time widths less than 10.sup.−9 seconds. The ultrashort laser pulses etch the surface of the steel mold to remove a coating of the steel mold to form an etched layer. The forming case has a lower member and an upper member. The lower member is a concavity, and an inner surface of the lower member is provided with a lower curved surface. The upper member is provided with a protrusion corresponding to the lower member, and an outer surface of the protrusion is provided with an upper curved surface corresponding to the lower curved surface. The protrusion is capable of being placed in a concavity of the lower member to form a gap between the lower curved surface and the upper curved surface.

A drill device includes a drill tip and a drill body having a rear portion. The drill tip includes at least a first clearance surface and the drill body includes at least a first land having a margin. An edge is disposed between the first clearance surface and the margin. A textured area having a plurality of recesses extends along at least a portion of the margin, in the direction of the rear portion of the drill body, from a position of 200 μm from the edge, from a position on the least first clearance surface, or from a position therebetween.

Thin-film devices, for example, multi-zone electrochromic windows, and methods of manufacturing are described. In certain cases, a multi-zone electrochromic window comprises a monolithic EC device on a transparent substrate and two or more tinting zones, wherein the tinting zones are configured for independent operation.

Thin-film devices, for example, multi-zone electrochromic windows, and methods of manufacturing are described. In certain cases, a multi-zone electrochromic window comprises a monolithic EC device on a transparent substrate and two or more tinting zones, wherein the tinting zones are configured for independent operation.

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that oscillates a laser, a Y-axis scanner that executes a high-speed scan with a laser beam emitted from the laser oscillator in a Y-axis direction, an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and a beam condenser. The Y-axis scanner is selected from any of an AOD, a resonant scanner, and a polygon scanner and the X-axis scanner is selected from a galvano scanner and a resonant scanner.

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that oscillates a laser, a Y-axis scanner that executes a high-speed scan with a laser beam emitted from the laser oscillator in a Y-axis direction, an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and a beam condenser. The Y-axis scanner is selected from any of an AOD, a resonant scanner, and a polygon scanner and the X-axis scanner is selected from a galvano scanner and a resonant scanner.

A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.

A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.

A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.