A manufacturing method is provided. During this method, a preform component for a turbine engine is provided. This preform component includes a substrate and an outer coating on the substrate. A cooling aperture is formed in the preform component. The cooling aperture includes a diffuser section and a meter section. The diffuser section extends through the outer coating and into the substrate. The meter section extends within the substrate. The forming of the cooling aperture includes: forming the diffuser section using a first machining process; and forming the meter section using a second machining process that is different than the first machining process.

A manufacturing method is provided. During this method, a preform component for a turbine engine is provided. This preform component includes a substrate and an outer coating on the substrate. A cooling aperture is formed in the preform component. The cooling aperture includes a diffuser section and a meter section. The diffuser section extends through the outer coating and into the substrate. The meter section extends within the substrate. The forming of the cooling aperture includes: forming the diffuser section using a first machining process; and forming the meter section using a second machining process that is different than the first machining process.

A manufacturing method is provided. During this method, a preform component is provided for a turbine engine. The preform component includes a substrate comprising electrically conductive material having an outer coating comprising non-electrically conductive material applied over a surface of the substrate. A preform aperture is formed in the preform component using an electrical discharge machining electrode. The preform aperture includes a meter section of a cooling aperture in the substrate. The preform aperture also includes a pilot hole in the outer coating. A diffuser section of the cooling aperture is formed in at least the outer coating using a second machining process.

A glass container that includes a base defining a hole, and methods of manufacturing and using the glass container, is disclosed. The glass container is manufactured by providing the container and cutting a hole in a wall of the container. The hole may be cut into the wall by any technique in which glass material is separated from the wall including by mechanical shearing, thermal energy, and/or fluid impingement. To use the glass container, a deformable blow-out plug may be inserted into the hole to fluidly seal the hole, a liquid beverage may be introduced into the container, a closure may be coupled to the container to close the container and provide a pressurizable package, and thereafter the package may be internally pressurized by introducing a pressurizing gas into the package.

A method of manufacturing an optionally shaped chip from a substrate having a crystalline structure includes establishing a projected dicing line on the substrate representing a contour of a chip to be fabricated from the substrate, and establishing a straight division assisting line contacting the contour of the chip for assisting in dividing the substrate. A division initiating point is formed after the projected dicing line is established and a laser beam is applied along the contour of the chip and the division assisting line while positioning a focused spot of the laser beam in the substrate at a predetermined position spaced from an upper surface of the substrate, thereby forming division initiating points in the substrate. The substrate is divided by applying external forces to the substrate in which the division initiating points have been formed, to divide the substrate along the division initiating points.

A method of manufacturing an optionally shaped chip from a substrate having a crystalline structure includes establishing a projected dicing line on the substrate representing a contour of a chip to be fabricated from the substrate, and establishing a straight division assisting line contacting the contour of the chip for assisting in dividing the substrate. A division initiating point is formed after the projected dicing line is established and a laser beam is applied along the contour of the chip and the division assisting line while positioning a focused spot of the laser beam in the substrate at a predetermined position spaced from an upper surface of the substrate, thereby forming division initiating points in the substrate. The substrate is divided by applying external forces to the substrate in which the division initiating points have been formed, to divide the substrate along the division initiating points.

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.

A method of laser processing of a metallic material is described by means of a focused laser beam having a predetermined transverse power distribution on at least one working plane of the material, comprising the steps of: providing a laser beam emitting source; leading the laser beam along a beam transport optical path to a working head arranged in proximity to the material; collimating the laser beam along an optical axis of propagation incident on the material; focusing the collimated laser beam in an area of a working plane of the material; and conducting the focused laser beam along a working path on the metallic material comprising a succession of working areas, wherein the laser beam is shaped: by reflecting the collimated beam by means of a deformable controlled surface reflecting element having a plurality of independently movable reflection areas, and by controlling the arrangement of the reflection areas to establish a predetermined transverse power distribution of the beam on at least one working plane of the metallic material as a function of the area of the current working plane and/or of the current direction of the working path on the metallic material.

A step of preparing a resin plate-equipped metal mask including a metal mask in which a slit is provided and a resin plate, and a step of laser irradiation from the metal mask side to form an opening corresponding to a pattern to be produced by vapor deposition in the resin plate are included, wherein in the step of forming the opening, by using a laser mask in which an opening region corresponding to the opening and an attenuating region that is positioned in a periphery of the opening region and attenuates energy of the laser, the opening corresponding to the pattern to be produced by vapor deposition is formed with respect to the resin plate with the laser that passes through the opening region, and a thin part is formed in a periphery of the opening of the resin plate with the laser that passes through the attenuating region.

A step of preparing a resin plate-equipped metal mask including a metal mask in which a slit is provided and a resin plate, and a step of laser irradiation from the metal mask side to form an opening corresponding to a pattern to be produced by vapor deposition in the resin plate are included, wherein in the step of forming the opening, by using a laser mask in which an opening region corresponding to the opening and an attenuating region that is positioned in a periphery of the opening region and attenuates energy of the laser, the opening corresponding to the pattern to be produced by vapor deposition is formed with respect to the resin plate with the laser that passes through the opening region, and a thin part is formed in a periphery of the opening of the resin plate with the laser that passes through the attenuating region.