A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

Separation lines are formed in a glass plate having first and second main surfaces by irradiating with laser light. The separation lines are configured of a product line corresponding to an outline of a glass article to be separated; and a release line. The product line includes a first in-plane void array configured of in-plane voids arranged on the first main surface; and internal void arrays for product line, each having an in-plane void. The release line includes internal void arrays for release line. A maximum length of the internal void array for product line L.sub.1max is equal to a maximum length of the internal void array for release line L.sub.2max, and a minimum length of the internal void array for product line L.sub.1min is greater than a minimum length of the internal void array for release line L.sub.2min; or the length L.sub.1max is greater than the length L.sub.2max.

Separation lines are formed in a glass plate having first and second main surfaces by irradiating with laser light. The separation lines are configured of a product line corresponding to an outline of a glass article to be separated; and a release line. The product line includes a first in-plane void array configured of in-plane voids arranged on the first main surface; and internal void arrays for product line, each having an in-plane void. The release line includes internal void arrays for release line. A maximum length of the internal void array for product line L.sub.1max is equal to a maximum length of the internal void array for release line L.sub.2max, and a minimum length of the internal void array for product line L.sub.1min is greater than a minimum length of the internal void array for release line L.sub.2min; or the length L.sub.1max is greater than the length L.sub.2max.

A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

There is provided a manufacturing method of a protective-component-provided workpiece. The manufacturing method of a protective-component-provided workpiece includes a step of dissolving a thermoplastic resin whose solubility parameter is equal to or higher than 8.5, in a liquid ultraviolet-curable resin, to prepare a liquid mixed resin, a step of supplying the mixed resin to a support surface of a support table to form a resin layer with a predetermined thickness, a step of irradiating the resin layer with ultraviolet rays and curing the resin layer to form a protective component with a sheet shape, and a step of heating the sheet-shaped protective component before or after one surface of the sheet-shaped protective component and one surface of the workpiece are brought into close contact with each other, and causing the sheet-shaped protective component to come into close contact with the workpiece and integrate with the workpiece.

An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. The apparatus includes a stage; a laser module disposed above the stage and configured to output a laser beam; a scanner configured to receive the laser beam output from the laser module and irradiate the laser beam onto the stage; and a controller configured to control the laser module to irradiate the laser beam to a processing position while moving both the scanner and the stage in a first direction according to the processing position and a shape of a processing pattern.

The present disclosure provides a liquid crystal display panel and a display device. The liquid crystal display panel includes an array substrate. A hollow structure is defined in a common electrode layer. The hollow structure includes a first hollow structure corresponding to a display area. An area of the first hollow structure progressively increases along a direction from an array routing area to the display area, so that an area of the common electrode layer corresponding to the display area progressively decreases along the direction from the array routing area to the display area, thereby making RC loadings uniform and keeping charging rates in various areas same.

The present disclosure provides a liquid crystal display panel and a display device. The liquid crystal display panel includes an array substrate. A hollow structure is defined in a common electrode layer. The hollow structure includes a first hollow structure corresponding to a display area. An area of the first hollow structure progressively increases along a direction from an array routing area to the display area, so that an area of the common electrode layer corresponding to the display area progressively decreases along the direction from the array routing area to the display area, thereby making RC loadings uniform and keeping charging rates in various areas same.