A spatter protection system for an additive manufacturing machine can include a sheet configured to be disposed over a build area of the additive manufacturing machine. The sheet can include an aperture configured to allow a spatter from the build area to eject through the aperture during energy application and to land on a back side of the sheet to prevent the spatter from landing on the build area. The system can include a motive system supporting the sheet and configured to move the sheet to locate the aperture over an energy application area.

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

Varied embodiments of a laser-based machine tool, and techniques for controlling the same are provided. Some embodiments relate to techniques to facilitate uniform and reproducible processing of workpieces. Other embodiments relate to a zoom lens having a quickly-variable focal length. Still other embodiments relate to various features of a laser-based multi-axis machine tool that can facilitate efficient delivery of laser energy to a scan head, that can address thermomechanical issues that may arise during workpiece processing, etc. Another embodiment relates to techniques for minimizing or preventing undesired accumulation of particulate matter on workpiece surfaces during processing. A number of other embodiments and arrangements are also detailed.

A laser treatment system and method for imparting beneficial residual stresses into a desired part during production thereof by a Selective Laser Sintering or Melting (SLS/SLM) process, the method including repeatedly subjecting the part to an in-situ Laser Shock Peening (LSP) treatment during the SLS/SLM process. The in-situ LSP treatment includes selectively bringing an LSP module in contact with a surface of the part during the SLS/SLM process, and subjecting the LSP module to the action of a first laser beam to impart beneficial residual stresses into the part. The LSP module is movable between a building chamber where the part is being produced for the purpose of carrying out the in-situ LSP treatment, and a separate storage chamber when the LSP module is not used for the purpose of carrying out the in-situ LSP treatment. The invention is also implementable in a corresponding additive manufacturing system and method.

An electromagnetic radiation system (100) for directing an electromagnetic radiation beam at a target (130). The electromagnetic radiation system comprises an electromagnetic radiation source (110) for providing the electromagnetic radiation beam, a head (120) for projecting the electromagnetic radiation beam on to the target (130); and an umbilical assembly (140) connecting the electromagnetic radiation source (110) to the head (120) and configured to transmit the electromagnetic radiation beam to the head. The electromagnetic radiation system further comprises an optical isolator (150) positioned between the electromagnetic radiation source (110) and the umbilical assembly (140).

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

A processing machine for processing a workpiece with a processing beam includes a nozzle changer and a protective enclosure. The nozzle change is for mounting nozzles on or demounting nozzles from a processing head of the processing machine. The nozzle changer has multiple nozzle holders for holding nozzles. The protective enclosure is configured to close off a working space for the processing of the workpiece with the processing beam from a working space surrounding area. The nozzle changer is movable between a nozzle changing position within the protective enclosure and a setup position outside the protective enclosure.

Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).

This specification describes systems, methods, and architectures related to generating a plasma shield for laser operations. An example system for generating a plasma shield includes a laser head for directing a laser beam towards a target area on a workpiece. The path of the laser beam from the laser head to the target area on the workpiece is substantially surrounded by a plasma shield, which may form a gas-impermeable barrier. The plasma shield is configured to prevent the ingress of atmospheric or environmental gases, for example oxygen, into an area which would allow the gas to be in contact with the area of the workpiece being interacted with by a laser beam. The shape or location of the plasma shield may be controlled or altered using a magnetic field.