An iron tip cleaner device includes a cleaner portion that strips off a solder residue adhered to an iron tip of a soldering iron through jetting of air; an air supply portion supplying, to the cleaner portion, the air to be jetted; and an air exhaust portion exhausting the air jetted to the soldering iron. The air exhaust portion includes a first opening that is an opening through which the air jetted to the soldering iron is discharged and a second opening that is an opening of a pipe starting from an air supply port, a flow of air jetted from the second opening promotes the discharge of the air from the first opening, and air supplied to the air supply portion which supplies, to the cleaner portion, the air to be jetted and the air jetted from the second opening are supplied from one common air supply port.

The present invention is to provide a mechanism that does not cause a situation such as corrosion of the iron tip with an air nozzle due to blowing off solder from the iron tip of the soldering iron, and a mechanism capable of coping with various shapes of iron tips. In order to achieve the object of the present invention, an iron tip cleaner device for a soldering iron includes a cleaner chamber including a wall surface and an air jetting holes that is provided in the wall surface and jets air for blowing off solder on an iron tip. The solder on the iron tip is blown off by convection air generated when the air jetted from the air jetting holes collides with the wall surface.

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.

A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.

A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.

The present invention is to provide a mechanism that does not cause a situation such as corrosion of the iron tip with an air nozzle due to blowing off solder from the iron tip of the soldering iron, and a mechanism capable of coping with various shapes of iron tips. In order to achieve the object of the present invention, an iron tip cleaner device for a soldering iron includes a cleaner chamber including a wall surface and an air jetting holes that is provided in the wall surface and jets air for blowing off solder on an iron tip. The solder on the iron tip is blown off by convection air generated when the air jetted from the air jetting holes collides with the wall surface.

A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.