A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

Method for joining of at least two unweldable materials, non-weldable directly to each other with thermal joining processes in a lap joint configuration, where a two step sequence is used consisting of a first step to apply a thermomechanical or mechanical surface protection layer on the surface of an unweldable material and a second step, where a thermal joining process is used to joint the sprayed layer with an applied layer sheet.

A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at a fixed tip temperature ramp rate during the soldering event; and provided at an adjustable tip temperature ramp rate during the soldering event.

A method for adjusting furnace temperature of a reflow oven by AI, through obtaining product data of the reflow oven, obtaining initial characteristic data of a preceding work station and calculating mean values of temperatures of an upper furnace and a lower furnace, and taking the mean values as initial reflow characteristic data. Data as to first reflow characteristics of each reflow temperature zone and second reflow characteristics data of each zone are obtained, and data of the first and second reflow characteristics data are obtained. The electronic device further combines the characteristic data of the preceding work station with the combined reflow characteristics and combines results into a trained neural network model to output a temperature prediction, the oven temperature being adjusted according to the temperature prediction.

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.

A heater-sensor complex 10 includes a heating wire 12, a lead wire 14 which is made from the same metal of the heating wire 12 and connected to the proximal end of the heating wire 12, the lead wire 14 having a bigger diameter than the heating wire 12, a non-heating wire 16 constituted by a different metal from the metal constituting the heating wire 12, and a sensor head 18 constituted by a metal different from the metal constituting the heating wire 12 or the metal constituting the non-heating wire 16. The sensor head 18 have a lower thermal conductivity than the non-heating wire. To the sensor head 18, the distal end of the heating wire 12 and the distal end of the non-heating wire is connected. The heating wire 12 and the non-heating wire 16 electrically conducts at least through the sensor head 18.

A method for joining of at least two materials, non-weldable directly to each other with thermal joining processes in a lap joint configuration includes a two step sequence including a first step to apply a thermomechanical or mechanical surface protection layer on the surface of a (stainless) steel substrate and a second step where, a thermal joining process is used to weld the sprayed layer with an applied aluminum sheet without having brittle intermetallic phases in the whole material configuration.

A system for assembling a vehicular window assembly includes a heating device that, when electrically operated, heats an electrical connector disposed at a glass panel of a vehicular window assembly to heat and melt solder disposed between the electrical connector and an electrically conductive trace established at the glass panel to form a solder joint providing electrically-conductive connection between the electrical connector and the electrically conductive trace established at the glass panel. A temperature sensor captures sensor data indicative of a temperature of the electrical connector and the solder. The system, based on processing at an electronic control unit (ECU) of the captured sensor data, adjusts electrical operation of the heating device to adjust the temperature of the electrical connector and the solder during the soldering process that forms the solder joint.

An apparatus is described for carrying out controlled local heating a target surface of a substrate provided with a heat sensitive material to change a state of the heat sensitive material. The apparatus includes a carrier having a carrier surface for carrying the substrate at a carried surface opposite the target surface. The carrier has a plurality of laterally distributed heating zones that are thermally insulated from each other by slits that are in communication with an evacuation channel. The respective heating zones include respective resistive heating elements and are thermally coupled to a heat sink. The apparatus further includes a controller configured to control a selective supply of electric energy to at least one of the respective resistive heating elements of at least one of the plurality of laterally distributed heating zones.

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.