Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.

A solder supply unit includes a base member, a reel holder that is provided on the base member and rotatably holds a reel of a tape-like solder material, a support member provided on the base member, and a guidance member that is provided on the support member and that guides at least a lower surface of the tape-like solder material wound around the reel when the tape-like solder material is fed out.

The present disclosure provides methods for bonding a first downhole tool to a borehole tubular, which include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The methods may also include rupturing the shells of the solder particles to release the liquid metal cores. The methods may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.

Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

A soldering nozzle (100) for selectively soldering assemblies by means of molten solder supplied through a soldering nozzle (100) from a solder bath. The soldering nozzle (100) is designed as a deep-drawn part. A method for the production of a soldering nozzle (100) is specified as well, including the provision of a blank (401); the drawing of the blank (401) through at least one female die (411, 421) by means of at least one male die (413, 422, 431) to produce an oblong shape (439) of locally annular or substantially annular cross-section, with a first end (436) corresponding to an action point of the male die (413, 422, 431) and a second end (437) corresponding to an introduction cross-section of the male die (413, 422, 431), the cross-section preferably increasing from the first end (436) towards the second end (437); and the formation of an opening (446) at the tip end (436).

A method for fabrication includes providing a donor sheet, including a donor substrate, which is transparent in a specified spectral range, a sacrificial layer, which absorbs optical radiation within the specified spectral range and is disposed over the donor substrate, and a donor film, which includes a paste and is disposed over the sacrificial layer. The donor sheet is positioned so that the donor film is in proximity to a target location on an acceptor substrate. A pulsed laser beam impinges on the sacrificial layer with a pulse energy and spot size selected so as to ablate the sacrificial layer, thus causing a viscoelastic jet of the paste to be ejected from the donor film and to deposit, at the target location on the acceptor substrate, a dot having a diameter less than the spot size of the laser beam.

In a film formation step of a brazing method, a metal brush formed by bundling a plurality of metal wires is brought into contact with a film formation target portion of a workpiece. Here, the film formation target portion is a portion that includes a joining target portion and a brazing-material-allowed portion but does not include an avoidance portion. In this state, the film formation target portion and the metal brush are relatively moved to each other. Thus, the metal film is formed on the film formation target portion. In a brazing step, the joining target portions are joined in a state where a brazing material is arranged on the joining target portion and the brazing-material-allowed portion.

A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.