There is provided a flux applying apparatus configured to jet and apply a flux to a target, whereby the flux applying apparatus is capable of rapidly collecting a surplus flux in a sub-tank and returning the same to the main tank for further jetting and applying. In particular, the flux applying apparatus is coupled to a control unit capable of estimating a flux amount trapped in the sub-tank on the basis of a time period for which the flux is to be jetted from the nozzle.

A soldering apparatus includes a solder bath, an ejection nozzle and a solder flow slowing ramp. The solder bath is configured to hold molten solder. The ejection nozzle ejects the molten solder supplied from the solder bath. The solder flow slowing ramp i) is disposed adjacent to an outlet of the ejection nozzle and receives the molten solder overflowing from the ejection nozzle, and ii) downwardly slopes toward a liquefied solder surface of the molten solder in the solder bath so as to return the molten solder overflowing from the ejection nozzle to the solder bath.

A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.

A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.

Maintenance of a flow tank is facilitated. A sub-module is provided adjacent to a main module. A board is introduced in the sub-module, and is heated by a heater that is at a heating position, is moved to the main module, solder is applied by a flow tank in parallel with insertion of a component by a component insertion device, and thereby the component is mounted. If a maintenance condition is established, introduction of boards is stopped, the heater is moved to a standby position, and the flow tank is moved to a maintenance position of the sub-module. Maintenance is performed on the flow tank and since the component insertion device is not present above the flow tank, it is possible to facilitate inspection, removal, and the like of the flow tank.

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

A soldering pump for pumping an electrically conductive fluidin particular, a liquid soldersaid soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation.

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).

A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

A forced-feed pressure control device according to an embodiment includes a pressure detection nozzle, a pressure detector, and a controller. One end of the pressure detection nozzle is inserted into a casing member from which molten solder is forcibly fed to a solder jet nozzle of a jet-flow soldering device. The pressure detector is connected to another end of the pressure detection nozzle to detect a pressure of molten solder forcibly input from the one end into the pressure detection nozzle by using gas that exists between the molten solder inside the pressure detection nozzle and the pressure detector. The controller adjusts a forced-feed pressure of the molten solder to the solder jet nozzle so that the pressure of the molten solder to be detected by the pressure detector becomes a reference pressure.