A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.

A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

The disclosure herein relates to a bonding device and a bonding method used in a microcomponent process, and a welding-agent placing unit. The method includes the following. A microcomponent to-be-bonded is peeled from a substrate, picked up and transferred, by a transfer unit, the microcomponent to-be-bonded to a welding-agent placing unit so as to make the electrode to-be-bonded adhere to the molten welding agent from a welding-agent hole in the welding-agent placing unit. The microcomponent to-be-bonded with molten welding agent is transferred to a driving backplate so as to realize the bonding process between the microcomponent to-be-bonded and the driving backplate after cooling of welding agent.

The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.