The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

A grinding machine includes a conveying structure and a grinding structure, the conveying structure having first clamper sets for clamping a square rod. The grinding machine further includes a first top seat formed in at least one of the first clamper sets, and at least one second top seat formed in the grinding structure; the first top seat and the second top seat respectively abut against two opposite sides of the square rod; abutment surfaces of two first top seats are coplanar in a vertical plane, and are parallel to an abutment surface of the second top seat; a plane of the abutment surface of the first top seat is perpendicular to a plane of at least one abutment surface of the first clamper sets. The grinding machine according to the present disclosure may adjust the attitude of the square rod, thereby ensuring a stable grinding process.

A grinding machine includes a conveying structure and a grinding structure, the conveying structure having first clamper sets for clamping a square rod. The grinding machine further includes a first top seat formed in at least one of the first clamper sets, and at least one second top seat formed in the grinding structure; the first top seat and the second top seat respectively abut against two opposite sides of the square rod; abutment surfaces of two first top seats are coplanar in a vertical plane, and are parallel to an abutment surface of the second top seat; a plane of the abutment surface of the first top seat is perpendicular to a plane of at least one abutment surface of the first clamper sets. The grinding machine according to the present disclosure may adjust the attitude of the square rod, thereby ensuring a stable grinding process.

The present invention provides an apparatus for treating the surface of a radome, comprising: a rotary driving unit; a vacuum suction unit; a vertical driving unit; and a surface treatment unit. The rotary driving unit comprises: a rotary shaft; and a driving motor, installed at a predetermined portion spaced apart from the rotary shaft. The vacuum suction unit comprises: a plurality of first hydraulic cylinders positioned on the rotary shaft in the circumferential direction; and a suction plate equipped at an end of a piston rod of each of the first hydraulic cylinders. The vertical driving unit comprises: a mounting plate having a hole formed in the central portion thereof. The surface treatment unit comprises: a support column vertically installed on a predetermined portion spaced apart from the mounting plate; and a support arm.

The present invention provides an apparatus for treating the surface of a radome, comprising: a rotary driving unit; a vacuum suction unit; a vertical driving unit; and a surface treatment unit. The rotary driving unit comprises: a rotary shaft; and a driving motor, installed at a predetermined portion spaced apart from the rotary shaft. The vacuum suction unit comprises: a plurality of first hydraulic cylinders positioned on the rotary shaft in the circumferential direction; and a suction plate equipped at an end of a piston rod of each of the first hydraulic cylinders. The vertical driving unit comprises: a mounting plate having a hole formed in the central portion thereof. The surface treatment unit comprises: a support column vertically installed on a predetermined portion spaced apart from the mounting plate; and a support arm.