An endless abrasive belt for a sanding machine includes a flexible support structure, on an upper side of the support structure, an active layer with a binder and abrasive grains held in the binder. A transponder device is affixed to an underside of the endless abrasive belt, the transponder device including an attachment region and a flag, the attachment region being glued onto the underside by an adhesive layer, the flag being held by the attachment region and projecting laterally away from the endless abrasive belt, and a transponder including a transponder chip and an aerial for a wireless data connection with the sanding machine is arranged in the flag.

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.

A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding mechanism, a polishing head, and a head cleaning device configured to supply the cleaning liquid to the polishing head to clean the polishing head during polishing and/or after polishing of the substrate.

A finishing device includes a finishing belt, a finishing belt holding device, a first drive configured to rotationally drive a workpiece about a workpiece axis, and a second drive configured to oscillate the workpiece and the finishing belt relative to another along the workpiece axis. The finishing belt holding device has a holding section configured to hold a portion of the finishing belt. The portion has an active area configured to finish a circumferential workpiece surface. The portion extends in a plane which is vertical when referring to the direction of gravity and extends in a horizontal direction when referring to the direction of gravity and when viewing in the running direction of the finishing belt. The finishing device includes a workpiece holding device defining a workpiece holding axis which is vertical when referring to the direction of gravity.

A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding mechanism, a polishing head, and a head cleaning device configured to supply the cleaning liquid to the polishing head to clean the polishing head during polishing and/or after polishing of the substrate.

An attachment for a drill comprises a shank with a chuck configured to mount the attachment to the drill. A housing on the shank comprises a threaded end and a hollow chamber. A compression bladder having a tubular opening through it is configured to be inserted into the hollow chamber. A tube comprising a sanding or cleaning surface located on the inner surface of the tube is configured to be insertable into the tubular opening of the compression bladder. A threaded lid having a circular opening that is at least the same diameter as the inner diameter of the tube is configured to mount onto the housing at the threaded end and compress the compression bladder thereby reducing the diameter of the tubular opening and compressing the compression bladder against the tube to secure the tube within the housing.

A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.

Loopback rolls which can transfer and guide a polishing tape (T) along a perimeter of a pressure contact roll (R) is provided, the pressure contact roll having a tapered peripheral edge having a top edge and a pair of slant edge faces formed on a periphery of the pressure contact roll, by which the polishing tape can be bent into a substantially V-shape in cross section, and a switchable pressure contact mechanism is switchably provided which pressure contacts each of bent portions of the polishing tape, which is bent into the substantially V-shape in cross section by the tapered peripheral edge, to one tooth face (B1) or the other tooth face of a worm.