B24B21/008

Chemical planarization

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.

DEVICE AND METHOD FOR PROVIDING A SUGGESTION FOR THE OPTIMAL ADJUSTMENT OF A SHEET METAL WORKING MACHINE
20230108679 · 2023-04-06 · ·

A machine for machining sheet metal parts has a plurality of machining stations along a continuous conveyor belt, including a first sanding belt unit with an endlessly rotating sanding belt, a brush unit with horizontally rotating abrasive brushes and a second sanding belt unit with a fine-grained sanding belt. The three machining stations can be adjusted independently, and the machining tools are interchangeable. The technical data of the machining tools is stored in a tool memory. The machine includes a device for providing a suggestion for an optimal adjustment as well as an operator terminal with a touch screen, via which the user can make inputs and/or receive information from or about the machine. Based on the data entered by the user and the data stored in the machine, the user receives a suggestion for the optimal adjustment of the machine and is prompted to change the tool if necessary.

Method for operating a grinding device

A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

FINISHING DEVICE FOR FINISH MACHINING OF A WORKPIECE, IN PARTICULAR OF A CRANKSHAFT OR A CAMSHAFT
20170232570 · 2017-08-17 ·

A finishing device for finish machining of a workpiece, in particular of a crankshaft or a camshaft, comprising a workpiece holder and a rotary drive for rotating the workpiece about the workpiece axis thereof, comprising at least one first finishing tool for machining a main bearing concentric to the workpiece axis and at least one second finishing tool for machining an additional bearing, wherein the finishing tools can be moved along a transport axis which extends via a working area defined by the workpiece holder so that the finishing tools can be moved into an additional area arranged outside the working area.

Compression line spring grinding device
09718162 · 2017-08-01 · ·

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units each having first support blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units each having second support blocks (215) for compressing downward upper portions of the compression line springs and thus supporting the compression line springs. The grinding units grind seat surfaces formed on opposite ends of the compression line springs that are moved by the upper and lower chain conveyors. A V-shaped depression (115a) is formed in each first support block so that each of the compression line springs is seated onto the corresponding V-shaped depression. A lower surface (215a) of the second support block that compresses the compression line springs has a planar structure.

Apparatus of manufacturing panel for home appliance and method of manufacturing the home appliance

Disclosed herein are an apparatus of manufacturing a panel for home appliance by performing uniform surface processing on the panel and a method of manufacturing a home appliance by performing uniform surface processing on a panel. The apparatus of manufacturing a panel for home appliance includes a contacting roller configured to perform surface-processing on a panel that is to be processed; a pressing roller configured to press the panel toward the contacting roller; and a supporting roller configured to support a center middle portion of the contacting roller.

PAINT REPAIR PROCESS BY SCENARIO

A method and associated system provides automated abrasive paint repair using automated abrasive paint repair devices that selectively sand, buff, and polish a substrate in response to received instructions generated by a controller. The controller receives coordinates of each identified defect in the substrate along with parameters describing characteristics of each defect, selects a sanding process, a buffing process, and/or a polishing process based on empirically derived rules established by skilled/expert human operators and the received parameters. The controller outputs instructions to cause the automated abrasive paint repair devices to execute the selected sanding process, buffing process, and/or polishing process using the received parameters. The empirically derived rules and parameters may be stored in a lookup table and/or updated by a machine learning module.

Unknown
20220023993 · 2022-01-27 ·

Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.

Belt grinder

This disclosure relates to a belt grinder includes frame and first grinding assembly. The first grinding assembly includes transmission roller set, grinding belt and adjusting assembly. The transmission roller set includes driving roller and driven roller. Both the driving roller and the driven roller are rotatably disposed on the frame. The grinding belt is installed over the driving roller and the driven roller. The adjusting assembly includes rotatable component and contact rollers. The rotatable component is rotatably disposed on the frame. Rotation axis of the rotatable component is parallel to rotation axis of the driving roller. The contact rollers are rotatably disposed on the rotatable component. Contact rollers are different in shape. The rotatable component is rotatable with respect to the frame so as to force one of the contact rollers to contact or to be separated from the grinding belt.

METHOD FOR COORDINATING AN IDENTIFICATION AND THE PROCESSING OF A DEFECT OF A WORKPIECE AND DEVICE FOR CARRYING OUT THE METHOD
20220222765 · 2022-07-14 ·

A method for coordinating an identification of a defect in the surface coating of a workpiece and processing same via grinding and/or polishing using at least one grinding or polishing tool that is moveable over the defect in an automatic and computer-controlled manner based a stored program is provided. The surface coating of the workpiece is automatically optically scanned and the scanned position data is detected in a database. The defect is identified by comparing the detected position data with stored target data of the workpiece. Possible movements of the grinding or polishing tool are simulated to process the defect. The setting data for the grinding or polishing tool determined in the simulation is forwarded to a master computer. The determined processing data for processing the defect is transferred to the grinding or polishing tool. The defect is processed using the grinding or polishing tool.