A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3). Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3). Finally, a device for performing the methods is disclosed.

A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3). Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3). Finally, a device for performing the methods is disclosed.

An endless abrasive belt for a sanding machine includes a flexible support structure, on an upper side of the support structure, an active layer with a binder and abrasive grains held in the binder. A transponder device is affixed to an underside of the endless abrasive belt, the transponder device including an attachment region and a flag, the attachment region being glued onto the underside by an adhesive layer, the flag being held by the attachment region and projecting laterally away from the endless abrasive belt, and a transponder including a transponder chip and an aerial for a wireless data connection with the sanding machine is arranged in the flag.

An endless abrasive belt for a sanding machine includes a flexible support structure, on an upper side of the support structure, an active layer with a binder and abrasive grains held in the binder. A transponder device is affixed to an underside of the endless abrasive belt, the transponder device including an attachment region and a flag, the attachment region being glued onto the underside by an adhesive layer, the flag being held by the attachment region and projecting laterally away from the endless abrasive belt, and a transponder including a transponder chip and an aerial for a wireless data connection with the sanding machine is arranged in the flag.

A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3).

Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3).

Finally, a device for performing the methods is disclosed.

A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3).

Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3).

Finally, a device for performing the methods is disclosed.

An apparatus (10) for machining a workpiece (12) comprises at least two machining elements (14a, 14b) and a rotating belt (16) for moving the machining elements (14a, 14b) relative to a workpiece (12) to be machined. The machining elements (14a, 14b) each comprise a main body (20a, 20b) and a first connecting element (22a, 22b) connected to the main body (20a, 20b), which first connecting element is connectable to a second connecting element (24a, 24b) complementary to the first connecting element (22a, 22b) and connected to the belt (16). The first connecting element (22a, 22b) comprises a rotary body (26a, 26b). The second connecting element (24a, 24b) has a connection area (28a, 28b) for connection with the rotary body (26a, 26b). When the rotary body (26a, 26b) is rotated in a first rotary direction (R1) the rotary body (26a, 26b) is connected to the connection area (28a, 28b). When the rotary body (26a, 26b) is rotated in a second rotary direction (R2) opposed to the first rotary direction (R1) the rotary body (26a, 26b) is separated from the connection area (28a, 28b). The rotary body (26a, 26b) is arranged relative to the main body (20a, 20b) and connected to the latter in such a manner that during machining of the workpiece (12) a resulting force is exerted on the rotary body (26a, 26b) via the main body (20a, 20b), which force provides a torque for a rotation of the rotary body (26a, 26b) in the first rotary direction (R1).

An apparatus (10) for machining a workpiece (12) comprises at least two machining elements (14a, 14b) and a rotating belt (16) for moving the machining elements (14a, 14b) relative to a workpiece (12) to be machined. The machining elements (14a, 14b) each comprise a main body (20a, 20b) and a first connecting element (22a, 22b) connected to the main body (20a, 20b), which first connecting element is connectable to a second connecting element (24a, 24b) complementary to the first connecting element (22a, 22b) and connected to the belt (16). The first connecting element (22a, 22b) comprises a rotary body (26a, 26b). The second connecting element (24a, 24b) has a connection area (28a, 28b) for connection with the rotary body (26a, 26b). When the rotary body (26a, 26b) is rotated in a first rotary direction (R1) the rotary body (26a, 26b) is connected to the connection area (28a, 28b). When the rotary body (26a, 26b) is rotated in a second rotary direction (R2) opposed to the first rotary direction (R1) the rotary body (26a, 26b) is separated from the connection area (28a, 28b). The rotary body (26a, 26b) is arranged relative to the main body (20a, 20b) and connected to the latter in such a manner that during machining of the workpiece (12) a resulting force is exerted on the rotary body (26a, 26b) via the main body (20a, 20b), which force provides a torque for a rotation of the rotary body (26a, 26b) in the first rotary direction (R1).