A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular cross section, and a plurality of endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

Apparatus, systems, and/or methods for adjusting belt tension in a material removal machine are disclosed. In some examples, the material removal machine includes a material removal tool secured on a spindle. A spindle pulley may be secured to the spindle, such that rotation of the spindle pulley causes the material removal tool to be rotated via the spindle. The material removal machine may further include a movable hub that retains the spindle, such that movement of the hub translated into movement of the spindle. Because the spindle pulley is securely attached to the spindle, movement of the hub may translate into movement of the spindle pulley. This movement of the spindle pulley may change a distance between the spindle pulley and an actuator pulley, thereby changing the tension in a belt connecting the spindle pulley and the actuator pulley.

Apparatus, systems, and/or methods for adjusting belt tension in a material removal machine are disclosed. In some examples, the material removal machine includes a material removal tool secured on a spindle. A spindle pulley may be secured to the spindle, such that rotation of the spindle pulley causes the material removal tool to be rotated via the spindle. The material removal machine may further include a movable hub that retains the spindle, such that movement of the hub translated into movement of the spindle. Because the spindle pulley is securely attached to the spindle, movement of the hub may translate into movement of the spindle pulley. This movement of the spindle pulley may change a distance between the spindle pulley and an actuator pulley, thereby changing the tension in a belt connecting the spindle pulley and the actuator pulley.

A method cuts semiconductor wafers. The method includes: cutting a semiconductor ingot into a workpiece; and sawing the workpiece into slices using a wire grid having a fixed abrasive grain wire, while moving workpiece towards the wire grid. At a first contact of the workpiece with the wire grid, an initial cutting speed is less than 2 mm/min, coolant flow is less than 0.1 l/h and a wire speed is greater than 20 m/s. The workpiece is then guided through the wire grid until a first cutting depth is reached, and then the coolant flow is increased to at least 2000 l/h. The cutting speed is reduced to less than 70% of the initial cutting speed between the first contact of the workpiece with the wire grid up to a cutting depth of half a diameter of the cylinder, and is then increased.

In order to respond flexibly to various processing modes, such as forming curved surface shapes, when cutting a workpiece using a wire saw, this wire saw device (1) is provided with: a single robot arm (2) that is capable of moving freely by means of multi-axis control; a wire saw unit (3) that is detachably connected to the robot arm (2) via a tool changer (7); a wire (8) that spans a plurality of pulleys supported within the wire saw unit (3); and a workpiece cutting zone (20) that is established between the pulleys. The workpiece is cut to a prescribed shape by moving the robot arm (2) in a preset direction while running the wire (8) of the wire saw unit (3) and pressing the wire (8) against the supported workpiece.

In order to respond flexibly to various processing modes, such as forming curved surface shapes, when cutting a workpiece using a wire saw, this wire saw device (1) is provided with: a single robot arm (2) that is capable of moving freely by means of multi-axis control; a wire saw unit (3) that is detachably connected to the robot arm (2) via a tool changer (7); a wire (8) that spans a plurality of pulleys supported within the wire saw unit (3); and a workpiece cutting zone (20) that is established between the pulleys. The workpiece is cut to a prescribed shape by moving the robot arm (2) in a preset direction while running the wire (8) of the wire saw unit (3) and pressing the wire (8) against the supported workpiece.

An abrasive article comprising a substrate having an elongated body and abrasive particles attached to the elongated body, the content of the abrasive particles oscillates along the length of the body between a minimum and maximum value, and the minimum content is greater than 0.

A shaft cutting tool incorporating a scissor assembly having a first arm, a second arm, and a hinge interconnecting the arms' proximal ends; a shaft mount attached to the first arm's distal end; and a cutting wheel assembly operatively mounted within a hollow bore formed at the second arm's distal end; wherein the cutting wheel assembly includes a drive axle and rotary bearing; and wherein the drive axle extends oppositely from the cutting wheel for engagement with a portable electric drill.

A dicing device includes: a workpiece table; a cutting unit including a blade and a spindle; an XY-direction drive unit; a Z-direction drive unit; a first measuring instrument for measuring a Z-direction position of a surface of a workpiece held on a holding surface of the workpiece table; a second measuring instrument for measuring a Z-direction displacement of the holding surface; a correction amount calculation unit for calculating a correction amount for the Z-direction position of the cutting unit based on a table displacement map showing the Z-direction displacement at each position on the holding surface, the Z-direction displacement having been measured in advance by the second measuring instrument and based on the Z-direction position of the surface of the workpiece, measured by the first measuring instrument; and a control unit for controlling, when the workpiece is cut by a blade, the Z-direction drive unit based on the correction amount.