A fixed temperature liquid supply apparatus for supplying liquid adjusted in temperature to a processing apparatus including a processing unit includes a tank that accommodates the liquid, a thermometer that measures the temperature of the liquid accommodated in the tank, and a compressed gas supply pipe one end of which is connected to a compressed gas source reserving a compressed gas, the other end of which reaches the tank, and which supplies the compressed gas from the compressed gas source to the tank. The liquid accommodated in the tank is cooled by bubbles of the compressed gas, and the cooled liquid is supplied to the processing apparatus.

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

The present invention aims at eliminating a need for a protective cover such as a bellows cover and improving a collection rate of machining scraps, and includes machining tables that are fixed at least in X and Y directions on a horizontal plane and hold a workpiece, a machining mechanism that machines the workpiece with a rotary tool using a machining liquid, a moving mechanism that linearly moves the machining mechanism at least in each of the X and Y directions on the horizontal plane, and a machining scrap storage unit that is provided below the machining tables and stores machining scraps generated by machining by the machining mechanism.

A floor leveling apparatus and method for cutting parallel grooves in a hardened body which is configured to assist in utilizing a grinder to finish surfaces in a planar manner.

A wafer processing method includes a holding step of holding a wafer on a chuck table; a dressing step of cutting a peripheral marginal area of the wafer by a cutting blade mounted to a cutting unit to condition a state of a cutting edge; and a dividing step of cutting streets by the cutting blade mounted to the cutting unit to divide the wafer into individual device chips.

The present disclosure discloses a device for cutting connection of multi-piece module electrode which includes a stand, the stand is provided with a workbench and the workbench is connected with a height adjusting device. The device further includes an angle grinding device, the angle grinding device includes a polishing shaft and an angle grinder, the angle grinder is arranged on the polishing shaft, and the angle grinding device is provided with a saw blade. According to the characteristics of the module electrode, the angle grinding device is matched with the workbench to implement simultaneous electrode disconnecting operation of multiple electrodes of the module, so that the device not only has higher efficiency and better cutting effect, but also is suitable for universal saw blades, saves the cost, and is safer.

A cutting apparatus includes: a processing feeding unit that performs processing feeding of a chuck table adapted to hold a workpiece; and two cutting units in which rotational axes of two spindles coincide with each other and cutting blades mounted to the spindles face each other. Each cutting unit includes a flange mechanism in which the cutting blade having a cutting edge fixed to an outer peripheral edge of a one-side outer surface of a circular disk-shaped base is fixed to the spindle. The flange mechanism is fixed to a tip of the spindle, sucks an other-side outer surface of the base of the cutting blade, and fixes the cutting blade to the spindle with the one-side outer surface of the base exposed to the side of the tip of the spindle, and the one-side outer surfaces of the cutting blades fixed to the two cutting units.

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

A dressing method of a cutting blade includes a first cutting step of causing the cutting blade to cut into a dressing board held by a holding surface of a chuck table with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to form a cut groove in the dressing board, and a second cutting step of causing the cutting blade to further cut into the groove bottom of the cut groove formed in the first cutting step with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to carry out cutting on the groove bottom with tracing of the cut groove.

Apparatus, assemblies, and/or systems related to material removal are disclosed, such as saws, grinders, polishers, and/or more general material preparation and/or testing machines, for example. A material removal system may include a material removal machine that is configured to move via a material removal assembly. The material removal machine also includes a material removal tool configured to spin on a spindle at the urging of a tool actuator. The tool actuator is integrated into the material removal machine, such that the tool actuator moves along with the material removal machine.