A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

A polishing apparatus for an outer peripheral portion of a wafer includes: a stage for horizontally holding a disc-shaped wafer; a rotation drive unit for rotating the stage around its center axis as a rotation axis; polishing heads having an inner circumferential surface mounted with polishing pads; and a polishing-head drive mechanism for bringing the polishing pads into contact with the outer peripheral portion of the wafer and sliding the polishing heads in a direction slanted relative to a center axis of the wafer or a vertical direction thereof under application of a predetermined polishing pressure to the outer peripheral portion of the wafer. The inner circumferential surface of each of the polishing heads is mounted with two or more types of the polishing pads having different physical property values in the vertical direction.

A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

The present invention relates to a method for smoothing a surface of a component, in which a component is placed in a liquid-solids mixture; a relative movement is produced between the liquid-solids mixture and the component; thus there is a flow of the liquid-solids mixture along the surface; wherein there is provided in the liquid-solids mixture a guide surface, along which the liquid-solids mixture flows, wherein a directional component toward the surface is imposed on the flow.

The present invention relates to a method for smoothing a surface of a component, in which a component is placed in a liquid-solids mixture; a relative movement is produced between the liquid-solids mixture and the component; thus there is a flow of the liquid-solids mixture along the surface; wherein there is provided in the liquid-solids mixture a guide surface, along which the liquid-solids mixture flows, wherein a directional component toward the surface is imposed on the flow.

A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

A grinding tool kit, apparatus and method for finish machining of a rolling surface of a bearing roller. The apparatus comprises a main machine, an external circulation system, a grinding tool kit and a grinding tool kit clamp. A configuration of the main machine comprise a grinding strip assembly rotary type and a grinding sleeve rotary type. The external circulation system comprises a collection unit (41), a sorting unit (42), a feeding unit (43) and a transmission subsystem. The grinding tool kit comprises a grinding sleeve (21) remaining coaxial during working, and a grinding strip assembly penetrating through the grinding sleeve (21), an inner surface of the grinding sleeve (21) is provided with a first spiral groove (211); and the grinding strip assembly comprises a plurality of grinding strips (22), front surfaces of which are provided with linear grooves (221) or second spiral grooves distributed in a circumferential columnar array.

A lapping device for gear helix artifact with equal common normal by rolling method, use the rotary table to accurately control the angle between the lapping surface of whetstone and the axis of the base-circle cylinder to control the helix angle of base-circle about the involute helicoid. Use the whetstone driven component to drive the whetstone to make a high-precision linear motion in the vertical direction to adjust the position of the lapping surface of whetstone. The distance between the two lapping surface of whetstone is precisely adjusted by the gauge block to control the processing length of the three tooth common normal of the gear helix artifact. The invention provides a lapping device for gear helix artifact with equal common normal by rolling method, it conforms to the generation principle of the involute helicoid, and there is no machining principle error.

A lapping device for gear helix artifact with equal common normal by rolling method, use the rotary table to accurately control the angle between the lapping surface of whetstone and the axis of the base-circle cylinder to control the helix angle of base-circle about the involute helicoid. Use the whetstone driven component to drive the whetstone to make a high-precision linear motion in the vertical direction to adjust the position of the lapping surface of whetstone. The distance between the two lapping surface of whetstone is precisely adjusted by the gauge block to control the processing length of the three tooth common normal of the gear helix artifact. The invention provides a lapping device for gear helix artifact with equal common normal by rolling method, it conforms to the generation principle of the involute helicoid, and there is no machining principle error.