A Chemical Mechanical Polishing, CMP, process applied to a wafer of Silicon Carbide having a thickness of, or lower than, 200 μm, comprising the steps of: arranging the wafer on a supporting head of a CMP processing apparatus, the wafer having a front side and a back side opposite to one another, the front side housing at least one electronic component and being coupled to the supporting head; deliver a polishing slurry on the wafer, wherein the polishing slurry has a pH in the range 2-3; pressing the back side of the wafer against a polishing pad of the CMP apparatus exerting, by the supporting head, a pressure on the polishing pad in the range 5-20 kPa; setting a rotation of the polishing pad in the range 30-180 rpm, and setting a rotation of polishing head in the range 30-180 rpm; setting and maintaining a CMP process temperature equal to, or below, 50° C.

A platen for a metallographic grinder has an outer peripheral rim with an upper surface having a lower height. Also, fingers engaging a specimen are allowed to move laterally (i.e., wobble) to minimize the tipping forces on the specimen during the grinding process. Either one or both of these structures can be employed and results in a much flatter specimen surface for use in subsequent analysis.

A polishing head includes a first ring-shaped member having an opening; a plate-shaped member that closes the opening on an upper side of the first ring-shaped member; a membrane that closes the opening on a lower side of the first ring-shaped member; a back pad adhered to a lower surface of the membrane; and a second ring-shaped member located below the back pad and having an opening that holds a polishing target workpiece. A space formed by closing the opening of the first ring-shaped member by the plate-shaped member and the membrane includes: a central region; and an outer peripheral region partitioned from the central region by a partition, and an inner peripheral edge region of the second ring-shaped member is located vertically below an outer peripheral edge of the outer peripheral region. A polishing apparatus includes the polishing head, and is used in a method of manufacturing a semiconductor wafer.

The present disclosure relates to a vibration polishing device, comprising: a vibration drive for generating an oscillating vibration for polishing samples; a polishing disc which is connected to and can be driven by the vibration drive; and a polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc for being entrained therewith;
wherein the vibration drive comprises a base part, a counter-oscillating part, a vibration plate, and drive parts, for driving in an oscillating manner the counter-oscillating part and the vibration plate against the force of leaf springs.

A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional rotation of the carrier head about the axis, which allows for a greater area traversed on the polishing surface, improving chemical mechanical polishing uniformity on the substrate.

The present disclosure relates to a vibration polishing device, comprising: a vibration drive for generating an oscillating vibration for polishing samples; a polishing disc which is connected to and can be driven by the vibration drive; and a polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc for being entrained therewith;
wherein the vibration drive comprises a base part, a counter-oscillating part, a vibration plate, and drive parts, for driving in an oscillating manner the counter-oscillating part and the vibration plate against the force of leaf springs.

The present disclosure elates to a vibration polishing device, comprising: a vibration drive for generating an oscillating vibration for polishing samples; polishing disc which is connected to and can be driven by the vibration drive; and polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc; wherein the coupling between the polishing bowl and the polishing disc is accomplished by a quick-type coupling for transferring the oscillating vibrations from the polishing disc to the polishing bowl when the vibration polishing device is in operation and thereby to move the sample to be polished in the polishing bowl.

A polishing and loading/unloading component module comprises a loading/unloading module in the center and two polishing modules on both sides of the loading/unloading module. The loading/unloading module includes a loading/unloading table module which has two loading/unloading positions in a direction perpendicular to the arrangement direction of the two polishing modules. The loading/unloading table module can move back and forth between the two loading/unloading positions, or the two loading/unloading positions are provided with loading/unloading table modules apiece, corresponding to the two polishing modules respectively.

A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional rotation of the carrier head about the axis, which allows for a greater area traversed on the polishing surface, improving chemical mechanical polishing uniformity on the substrate.

The present disclosure relates to a vibration polishing device, comprising: a vibration drive for generating an oscillating vibration for polishing samples; polishing disc which is connected to and can be driven by the vibration drive; and polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc; wherein the coupling between the polishing bowl and the polishing disc is accomplished by a quick-type coupling for transferring the oscillating vibrations from the polishing disc to the polishing bowl when the vibration polishing device is in operation and thereby to move the sample to be polished in the polishing bowl.