A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.

The present invention discloses a grinding clamp, comprising a clamp main body. The clamp main body is provided with multiple elastic clamping portions, the elastic clamping portion and the clamp main body are of an integral structure formed integrally, and the elastic clamping portion is provided with a clamping gap, a clamping hole, and a distracting hole. The clamping hole and the distracting hole are both located at the clamping gap, a product is clamped at the clamping hole by means of the self-elasticity of the elastic clamping portion, the distraction hole is used for docking an external switch, and the clamping gap is distracted via the external switch so as to place the product; by providing an elastic clamping portion integrally formed with the clamp main body on the clamp main body, such that the addition of relying on an external connecting piece is eliminated, the structure is simplified.

The present invention discloses a grinding clamp, comprising a clamp main body. The clamp main body is provided with multiple elastic clamping portions, the elastic clamping portion and the clamp main body are of an integral structure formed integrally, and the elastic clamping portion is provided with a clamping gap, a clamping hole, and a distracting hole. The clamping hole and the distracting hole are both located at the clamping gap, a product is clamped at the clamping hole by means of the self-elasticity of the elastic clamping portion, the distraction hole is used for docking an external switch, and the clamping gap is distracted via the external switch so as to place the product; by providing an elastic clamping portion integrally formed with the clamp main body on the clamp main body, such that the addition of relying on an external connecting piece is eliminated, the structure is simplified.

In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

A method of processing a workpiece includes sticking an adhesive layer side of a resin sheet having a layered structure that includes an adhesive layer and a base material layer, to an annular frame having an opening in covering relation to the opening, forming surface irregularities on a face side of the base material layer that is opposite the adhesive layer, placing the face side of the workpiece and the face side of the base material layer in facing relation to each other and pressing the workpiece against the resin sheet or pressing the resin sheet against the workpiece, thereby bringing the workpiece into intimate contact with the resin sheet to fix the workpiece to the resin sheet, holding the face side of the workpiece fixed to the resin sheet on a holding surface of a chuck table, and grinding the reverse side of the workpiece with a grinding stone.

A method of processing a workpiece includes sticking an adhesive layer side of a resin sheet having a layered structure that includes an adhesive layer and a base material layer, to an annular frame having an opening in covering relation to the opening, forming surface irregularities on a face side of the base material layer that is opposite the adhesive layer, placing the face side of the workpiece and the face side of the base material layer in facing relation to each other and pressing the workpiece against the resin sheet or pressing the resin sheet against the workpiece, thereby bringing the workpiece into intimate contact with the resin sheet to fix the workpiece to the resin sheet, holding the face side of the workpiece fixed to the resin sheet on a holding surface of a chuck table, and grinding the reverse side of the workpiece with a grinding stone.

A grinding apparatus has a hermetically sealed chamber defined by a portion of a holding surface which extends radially outwardly from a wafer, an outer wall surface of a first annular packing, a lower surface of a plate, and an inner wall surface of a second annular packing. A negative pressure is developed by suction forces applied from the holding surface, allowing the atmospheric pressure to press the plate toward the holding surface and causing the first annular packing to press an outer circumferential portion of the wafer against the holding surface. Since the outer circumferential portion of the wafer is pressed against the holding surface under the suction forces from the holding surface and the atmospheric pressure, the forces pressing the outer circumferential portion of the wafer against the holding surface are increased easily at a low cost without increasing the size and weight of the grinding apparatus.