A driver interface for a grinding head includes a center plate having top and bottom surfaces, an outer edge, a mounting channel in the top surface, and mounting pads on the bottom surface, each pad having a raised edge. An upper clamping plate is inserted within the mounting channel. A lower clamping plate defines disk locating apertures and fastens to the bottom surface of the center plate so that each of the disk locating apertures surround the raised edge of a mounting pad. The upper and lower clamping plates are removably fastened to the center plate. A disk attacher having an anchoring portion and a disk receiving portion bends around the outer edge of the center plate so that the upper clamping plate when fastened to the center plate clamps the anchoring portion between the upper clamping plate and the mounting channel, and so that the lower clamping plate when fastened to the center plate clamps the disk receiving portion to a mounting pad and within one of the disk locating apertures.

The present invention relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the present invention relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head (10) includes an annular elastic member (40) configured to press a polishing tool (3) against the substrate (W), and a pressing-tool body (43) having a pressing surface (44) configured to press the polishing tool (3) against the substrate (W) via the elastic member (40), wherein the pressing surface (44) has a first fitting groove (45) in which a first portion (41) of the elastic member (40) fits, the first portion (41) protrudes from the pressing surface (44), the elastic member (40) is put on the pressing-tool body (43) with the elastic member (40) elastically deformed, and the polishing head (10) is configured to press the polishing tool (3) against the substrate (W) by the first portion (41).

The present invention relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the present invention relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head (10) includes an annular elastic member (40) configured to press a polishing tool (3) against the substrate (W), and a pressing-tool body (43) having a pressing surface (44) configured to press the polishing tool (3) against the substrate (W) via the elastic member (40), wherein the pressing surface (44) has a first fitting groove (45) in which a first portion (41) of the elastic member (40) fits, the first portion (41) protrudes from the pressing surface (44), the elastic member (40) is put on the pressing-tool body (43) with the elastic member (40) elastically deformed, and the polishing head (10) is configured to press the polishing tool (3) against the substrate (W) by the first portion (41).

An apparatus for machining flat workpieces has a machine frame including a workpiece support and at least one carrier unit positionable relative to the workpiece support The apparatus has a first and at least a second machining head, each machining head being connected to the carrier unit and each machining head comprising a tool carrier that is mounted rotatably about a first axis perpendicular to the workpiece support and that carries at least one tool that is mounted on the tool carrier eccentrically to the first axis rotatably about a second axis perpendicular to the workpiece support and is connected to a planet wheel that is gear-engaged with a sun wheel that is coaxial to the first axis. The tool carriers of the machining heads are drivable by at least a first drive unit The tool carrier of the first machining head is arranged such that it is movable in a shifting range (V1) along the first axis relative to the carrier unit Further, the tool carrier of the second machining head is arranged such that it is movable in a shifting area (V2) along the first axis relative to the carrier unit

A drive arrangement (300) for driving a planetary head (140) of a floor surfacing machine (100), the drive arrangement (300) comprising; a first drive wheel (310) arranged to be driven by a first motor (110), a second drive wheel (330) fixedly attached to the planetary head (140) and arranged to be driven by the first drive wheel via a connecting member (320), wherein the drive arrangement (300) comprises a protective casing (240) arranged to enclose the first (310) and second (330) drive wheels, and the connecting member (320), thereby protecting the drive arrangement (300) from dust, debris, and slurry.

A grinding method of grinding a first surface side of a wafer having an oxide film on the first surface includes a first grinding step of putting a grinding unit into grinding feeding while rotating a grinding wheel, rotating a chuck table holding under suction a second surface side at a first rotating speed, thereby causing lower surfaces of grindstones to break through the oxide film, then scraping off the oxide film by side surfaces of the grindstones, and forming a step in a circumferential direction of the wafer, a grinding unit raising step of spacing the grindstones from the wafer, and a second grinding step of putting the grinding unit into grinding feeding while rotating the grinding wheel to grind the wafer, in a state in which the chuck table holding under suction a second surface is rotated at a second rotating speed higher than the first rotating speed.

A grinding method of grinding a first surface side of a wafer having an oxide film on the first surface includes a first grinding step of putting a grinding unit into grinding feeding while rotating a grinding wheel, rotating a chuck table holding under suction a second surface side at a first rotating speed, thereby causing lower surfaces of grindstones to break through the oxide film, then scraping off the oxide film by side surfaces of the grindstones, and forming a step in a circumferential direction of the wafer, a grinding unit raising step of spacing the grindstones from the wafer, and a second grinding step of putting the grinding unit into grinding feeding while rotating the grinding wheel to grind the wafer, in a state in which the chuck table holding under suction a second surface is rotated at a second rotating speed higher than the first rotating speed.

A sanding tool includes a baseplate assembly, a housing assembly, a drive mechanism, and a fan assembly. The baseplate assembly includes a baseplate. The housing assembly includes a body housing. The housing assembly further includes a functional housing, where a hollow cavity is formed in the functional housing, the functional housing is provided with an inlet and an outlet that communicate with the hollow cavity, the inlet communicates with a dust removal channel of the sanding tool, the outlet is configured to discharge gas in the cavity, and the fan assembly is used for forming a dust removal air path moving towards the inlet. A ratio of an area of a projection of the functional housing on the baseplate to an area of the baseplate is greater than or equal to 0.15 and less than or equal to 0.95.

A sanding tool includes a baseplate assembly, a housing assembly, a drive mechanism, and a fan assembly. The baseplate assembly includes a baseplate. The housing assembly includes a body housing. The housing assembly further includes a functional housing, where a hollow cavity is formed in the functional housing, the functional housing is provided with an inlet and an outlet that communicate with the hollow cavity, the inlet communicates with a dust removal channel of the sanding tool, the outlet is configured to discharge gas in the cavity, and the fan assembly is used for forming a dust removal air path moving towards the inlet. A ratio of an area of a projection of the functional housing on the baseplate to an area of the baseplate is greater than or equal to 0.15 and less than or equal to 0.95.

A grinding head assembly for a floor processing machine includes a plate that has a first side that has a tool attachment surface and a second side opposite the first side. A plurality of lippage adapters are attached to the second side of the plate. The plurality of lippage adapters each include a base portion that have a tool contact surface partially surrounded at a perimeter wall and are removably attached to the second side of the plate with at least one fastener. Each of the plurality of lippage adapters includes at least one magnet fixed to the base portion.