A workpiece holding assembly (20) comprises a magnetic chuck (22), and first and second separate sets of workrests for engaging with the outer circumferential surface of an annular workpiece (40, 60). The workrests are configurable such that when the outer circumferential surface of the workpiece (40, 60) is ground with the chuck Urotating in one direction, the outer circumferential surface is only urged in contact with the first set (26, 28) of workrests, and when an inner circumferential surface of said workpiece is ground with the direction of rotation of the chuck reversed, the outer circumferential surface is only urged in contact with the second set (30, 32) of workrests. Grinding methods using such a workpiece holding assembly are also described.

A component according to the disclosure may include a body having an aperture therein for receiving one of a turbomachine shaft or a lathe chuck, wherein in response to the body being coupled to the lathe chuck, the aperture is oriented substantially axially relative to an axis of rotation of the body with the lathe chuck; and a flange coupled to and in direct axial contact with the body, the flange including a surface that extends axially relative to the axis of rotation of the body, wherein the surface of the flange comprises a matingly engageable face configured to contact an axially aligned surface during operation of the component and having a sanding indentation thereon, wherein a surface roughness of the surface of the flange is less than a surface roughness of a remainder of the component.

Stored is a height of a grinding mechanism when lower surfaces of grinding stones have come into contact with an upper surface of a wafer held on a holding surface, through lowering of the grinding mechanism from above the wafer. Based on this height, an origin point height which is a height of the grinding mechanism when the lower surfaces of the grinding stones have come into contact with the holding surface is then determined.

A workpiece centering gauge for a grinding machine includes a link having a first pivot configured to couple with the grinding machine; a first encoder that measures an angle of the link at the first pivot; a second pivot included with the link; a measuring fork configured to releasably contact an outer surface of an elongated workpiece; a surface feeler, having a transducer, included with the measuring fork that measures a workpiece diameter a second encoder that measures an angular position of the link relative to the measuring fork; the angular position measured by the first encoder, the angular position measured by the second encoder, and a measured workpiece diameter are used to determine a deviation of the elongated workpiece from a centerline.

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

Provided is a chuck structure, which is configured to chuck an annular workpiece from a radially outer side of the workpiece. The chuck structure includes: leaf spring members arranged at a predetermined pitch along a circumferential direction of the chuck structure so as to be symmetrical with respect to a mechanism center axis; chuck claw members mounted to distal ends of the leaf spring members, respectively; and a pressing force applying mechanism configured to apply a force of pressing the leaf spring members radially inward, to thereby elastically press the chuck claw members onto a radially outer surface of the workpiece.

A controllable magnetic field-assisted finishing apparatus for an inner surface and a finishing method are provided. The apparatus includes a housing, ball screw mechanisms, a workpiece, a centering clamp, a connecting plate, a magnetic field generating device, a chuck clamp, a precise displacement platform and a base. The magnetic field generating device includes electromagnetic coils, coil connecting plates, a magnetic yoke, nuts, springs and bolts. The magnetic field generating device dynamically adjusts a distance from the magnetic yoke to the outer surface of the workpiece through the springs. The movement tracks of the magnetic finishing medium are controlled by the formed rotation of the magnetic field, the finishing action force dynamic-adjustment, the optimization of the machining form of the magnetic finishing medium in collaboration with the rotation of the chuck clamp and the feed movement of the precise displacement platform.

A platen for a metallographic grinder has an outer peripheral rim with an upper surface having a lower height. Also, fingers engaging a specimen are allowed to move laterally (i.e., wobble) to minimize the tipping forces on the specimen during the grinding process. Either one or both of these structures can be employed and results in a much flatter specimen surface for use in subsequent analysis.

The present disclosure provides an automatic chuck apparatus comprising a mechanical chuck, a mechanical chuck mounting bracket, a hydraulic motor, a lifting mechanism, a chuck key and a lifting cylinder. The mechanical chuck is mounted above the mechanical chuck mounting bracket. The hydraulic motor, the lifting mechanism and the lifting cylinder are mounted below the mechanical chuck mounting bracket. The hydraulic motor is configured to control the rotation of the chuck key, the lifting cylinder is configured to drive the chuck key to ascend or descend through the lifting mechanism, thereby the mechanical chuck is locked or loosened by the chuck key. The present disclosure further provides a grinding wheel cutting apparatus and a cutting method. In the present disclosure, the locking of the chuck is automatically controlled, thereby improving the working efficiency and ensuring sufficient locking force of the chuck.

A pad carrier assembly that includes a coupling base and a pad carrier coupled to the coupling base, the coupling base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism. Embodiments of the present disclosure will provide a method of supporting a buffing pad in a horizontal pre-clean module. The method includes mechanically clamping or retaining a buffing pad on a peripheral edge of the buffing pad, wherein the coupling base and the pad carrier are coupled and disposed in a horizontal pre-clean module, and supporting the buffing pad and preventing the buffing pad from sagging, by use of one or more pad retaining features.