A machine tool comprises first and second support arms, and a rigid structure which couples the first support arm to the second support arm. A first rotary drive is operable to rotate the first support arm and the rigid structure relative to each other about a first rotational reference axis, and a second rotary drive is operable to rotate the second support arm and the rigid structure relative to each other about a second rotational reference axis, wherein the first and second rotational reference axes are parallel and spaced apart by a fixed distance. A control arrangement is configured to control the first and second rotary drives such that a workpiece mount carried by the second support arm follows a predetermined path relative to a tool mount carried by the first support arm in a plane perpendicular to the rotational reference axes.

The present invention discloses a planogrinder including a measuring device, wherein the measuring device can move along the X-axis direction, an optical probe is provided at one end of the measuring device close to a bed base, and the optical probe is used for real-time detection of an outer diameter of a workpiece being machined. The planogrinder provided by the present invention can measure dimensions of the workpiece during rotation through the measuring device, and can control the deformation of the workpiece during the rotation process, thereby making the machining accuracy of the workpiece controllable during use.

A polishing assembly and method for polishing optical cables, the polishing assembly having a platform configured to receive a polishing film and configured to rotate according to a dual orbital motion; a force gauge functionally coupled to the platform and configured to measure downward force applied against the platform; a mounting fixture configured to mount a plurality of optical cables; and a movable arm configured to move the mounting fixture downwards to press mounted cables against the polishing film, upwards to pull the mounted cables away from the polishing film, and to rotate circularly along a continuous circular path. The optical cables are pressed against the rotating polishing film while simultaneously monitoring the downward force applied against the platform so that downward force can be maintained within a prescribed tolerance throughout the polishing process.

A wheel conformal burr brushing device includes a lower lifting driving system, a central burr brushing system, a lower gear lifting unit, first burr brushing systems, second burr brushing systems, a synchronous clamping driving system and an upper burr brushing system.

A workpiece holding assembly (20) comprises a magnetic chuck (22), and first and second separate sets of workrests for engaging with the outer circumferential surface of an annular workpiece (40, 60). The workrests are configurable such that when the outer circumferential surface of the workpiece (40, 60) is ground with the chuck Urotating in one direction, the outer circumferential surface is only urged in contact with the first set (26, 28) of workrests, and when an inner circumferential surface of said workpiece is ground with the direction of rotation of the chuck reversed, the outer circumferential surface is only urged in contact with the second set (30, 32) of workrests. Grinding methods using such a workpiece holding assembly are also described.

A carrier head includes a base assembly, a substrate mounting surface connected to the base assembly, and a plurality of segments disposed circumferentially around the substrate mounting surface to provide a retaining ring to surround a substrate mounted on the substrate mounting surface. An inner surface of each of the plurality of segments is configured to engage the substrate, and each segment of the plurality of segments of the retaining ring is pivotally connected to the base assembly such that a lower portion of each segment of the retaining ring is swingable toward and away from the substrate.

A component according to the disclosure may include a body having an aperture therein for receiving one of a turbomachine shaft or a lathe chuck, wherein in response to the body being coupled to the lathe chuck, the aperture is oriented substantially axially relative to an axis of rotation of the body with the lathe chuck; and a flange coupled to and in direct axial contact with the body, the flange including a surface that extends axially relative to the axis of rotation of the body, wherein the surface of the flange comprises a matingly engageable face configured to contact an axially aligned surface during operation of the component and having a sanding indentation thereon, wherein a surface roughness of the surface of the flange is less than a surface roughness of a remainder of the component.

A machined wheel post-processing equipment includes a wheel inlet roller way, a lower machine frame, lower guide posts, lower air cylinders, a supporting plate, guide sleeves, a lifting table, guide rails, a clamping cylinder, a left sliding plate, a right sliding plate, a rack and pinion, servomotors, a lifting roller way, clamping wheels, a first servomotor, and a overturning platform.

A multi-station wheel deburring device is disclosed, which consists of a lower lifting translation system, a first brush system, a second brush system, a synchronous clamping drive system and a third brush system, etc. The multi-station wheel deburring device can be used for removing burrs from the root of a wheel flange, a center hole, bolt holes and a back cavity, can automatically adjust the position of each brush according to the dimension and shape of a wheel, and at the same time, has the characteristics of high automation, high removal efficiency, advanced technology, strong universality and high safety and stability.

A grinding apparatus has a hermetically sealed chamber defined by a portion of a holding surface which extends radially outwardly from a wafer, an outer wall surface of a first annular packing, a lower surface of a plate, and an inner wall surface of a second annular packing. A negative pressure is developed by suction forces applied from the holding surface, allowing the atmospheric pressure to press the plate toward the holding surface and causing the first annular packing to press an outer circumferential portion of the wafer against the holding surface. Since the outer circumferential portion of the wafer is pressed against the holding surface under the suction forces from the holding surface and the atmospheric pressure, the forces pressing the outer circumferential portion of the wafer against the holding surface are increased easily at a low cost without increasing the size and weight of the grinding apparatus.