An AE-signal detecting device for an abrasive wheel includes: an AE sensor which outputs an AE signal upon receipt of an elastic wave generated in an annular abrasive wheel sandwiched between a fixed flange fixed to a rotating shaft and a movable flange provided capable of getting closer to/separating from the fixed flange; a transmission circuit portion which wirelessly transmits the AE signal output from the AE sensor; and a reception circuit portion which receives the AE signal transmitted wirelessly, wherein the AE sensor is disposed on the movable flange or the fixed flange, detects the elastic wave transmitted from the abrasive wheel, and outputs the AE signal.

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller. The controller is configured to store data associating each of a plurality of conditioner disk products with a respective threshold value, receive an input selecting a conditioner disk product from the plurality of conditioner disk products, determine a particular threshold value associated with the selected conditioner disk product, receive a signal from the monitoring system, generate a measure of a pad cut rate from the signal, and generate an alert if the pad cut rate falls beyond the particular threshold value.

A blade sharpening system may include a sharpening tool for sharpening a workpiece. The system may also include a sharpening fixture having a mounting surface for mounting a workpiece to be sharpened by the sharpening tool. The mounting surface may be disposed on a sled that is movable along a sharpening path that passes under a sharpening implement that may be mounted to a movable arm of the sharpening tool when the arm is in an engaged position. The movement of the sled may be coupled to the movement of the arm such that moving the arm from a disengaged position to the engaged position initiates the sled to move in a first direction along the sharpening path and moving the arm from the engaged position to the disengaged position initiates the sled to move along the sharpening path in a second direction.

A blade sharpening system may include a sharpening tool for sharpening a workpiece. The system may also include a sharpening fixture having a mounting surface for mounting a workpiece to be sharpened by the sharpening tool. The mounting surface may be disposed on a sled that is movable along a sharpening path that passes under a sharpening implement that may be mounted to a movable arm of the sharpening tool when the arm is in an engaged position. The movement of the sled may be coupled to the movement of the arm such that moving the arm from a disengaged position to the engaged position initiates the sled to move in a first direction along the sharpening path and moving the arm from the engaged position to the disengaged position initiates the sled to move along the sharpening path in a second direction.

A power tool is provided including a housing defining a cavity therein, where the housing includes a motor case and a handle portion extending along a longitudinal axis of the housing from the motor case; an electric motor having a drive shaft and mounted within the motor case; a partitioning wall extending radially and separating the motor case portion from the non-motor case portion of the housing; and a bearing pocket with an open end facing the motor case portion formed in the partitioning wall and a main body extending away from the electric motor for receiving a rotor bearing. The handle portion includes two elongate walls extending from the partitioning wall, a circuit board supported by the two elongate walls and including a motor drive circuit, and two covers secured to the two elongate walls to cover the circuit board.

A power tool is provided including a housing defining a cavity therein, where the housing includes a motor case and a handle portion extending along a longitudinal axis of the housing from the motor case; an electric motor having a drive shaft and mounted within the motor case; a partitioning wall extending radially and separating the motor case portion from the non-motor case portion of the housing; and a bearing pocket with an open end facing the motor case portion formed in the partitioning wall and a main body extending away from the electric motor for receiving a rotor bearing. The handle portion includes two elongate walls extending from the partitioning wall, a circuit board supported by the two elongate walls and including a motor drive circuit, and two covers secured to the two elongate walls to cover the circuit board.

An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.