Dynamic regulation of contact pressures in a blade sharpening system is provided. An example multiphase grinding wheel has a grinding face with one or more abrasive concentric rings for sharpening the cutting blade of the log saw machine, and one or more padded concentric rings consisting of fiber padding. Sharpening with the multiphase grinding wheel improves cut quality, increases blade life, removes glues and varnishes from the cutting blade, reduces blade deformation, and hones the edge of the cutting blade. A pneumatic tensioning system uses air bladders to apply dynamic cushioning and processor-controlled contact pressure between the grinding wheels and the cutting blade during sharpening. The fiber-padded grinding wheels and the air bladder tensioner provide improved sharpness of the cutting blade and longer life for the mechanical components.

Dynamic regulation of contact pressures in a blade sharpening system is provided. An example multiphase grinding wheel has a grinding face with one or more abrasive concentric rings for sharpening the cutting blade of the log saw machine, and one or more padded concentric rings consisting of fiber padding. Sharpening with the multiphase grinding wheel improves cut quality, increases blade life, removes glues and varnishes from the cutting blade, reduces blade deformation, and hones the edge of the cutting blade. A pneumatic tensioning system uses air bladders to apply dynamic cushioning and processor-controlled contact pressure between the grinding wheels and the cutting blade during sharpening. The fiber-padded grinding wheels and the air bladder tensioner provide improved sharpness of the cutting blade and longer life for the mechanical components.

A break-in processing apparatus is disclosed, which can reliably perform a break-in process for an elastic membrane without reducing a utilization rate of a polishing apparatus. The break-in processing apparatus includes a stage to which an elastic membrane assembly including a carrier and an elastic membrane attached to the carrier is placed; a break-in determination module facing the elastic membrane placed to the stage; a fluid supply unit configured to supply a pressurized fluid into a pressure chamber formed between the outermost periphery portion of the elastic membrane and the carrier; and a controller configured to control operations of the break-in determination module and the fluid supply unit. The controller determines a completion of a break-in process of the elastic membrane based on a load applied to the break-in determination module by the elastic membrane which is expanded by the pressurized fluid supplied into the pressure chamber.

A break-in processing apparatus is disclosed, which can reliably perform a break-in process for an elastic membrane without reducing a utilization rate of a polishing apparatus. The break-in processing apparatus includes a stage to which an elastic membrane assembly including a carrier and an elastic membrane attached to the carrier is placed; a break-in determination module facing the elastic membrane placed to the stage; a fluid supply unit configured to supply a pressurized fluid into a pressure chamber formed between the outermost periphery portion of the elastic membrane and the carrier; and a controller configured to control operations of the break-in determination module and the fluid supply unit. The controller determines a completion of a break-in process of the elastic membrane based on a load applied to the break-in determination module by the elastic membrane which is expanded by the pressurized fluid supplied into the pressure chamber.

A polishing device (1) includes a polishing brush (3) and a polishing brush holder (4) that holds the polishing brush (3). The polishing brush holder (4) includes a shank (6), a support mechanism (21) that has a sleeve (7) and supports the polishing brush (3) so as to be movable in an axial direction L of the shank (6), and a moving mechanism (22) that moves the polishing brush (3) in the axial direction L. The polishing brush holder (4) includes a pressure sensor (53) that detects a load (sensor detection pressure (P)) applied from a workpiece (W) to the polishing brush (3) when the workpiece (W) is polished by the polishing brush (3) supported by the support mechanism (21), and a control unit (51) that drives the moving mechanism (22) on the basis of the output (sensor detection pressure (P)) from the pressure sensor (53) to move the polishing brush (3) in the axial direction L.

A dual mounted end-effector system mounted on a motive robot arm for preparing an object surface is described. The system includes a first tool configured to contact and prepare the object surface and a second tool configured to contact and prepare the object surface. The system also includes a force control. The force control is configured to align, in a first state, with the first tool in position to contact and prepare the object surface and, in a second state, with the second tool in a position to contact and prepare the object surface.

A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

A combined electric tool coordination system includes a main tool (4) and an auxiliary tool (1). The main tool (4) and the auxiliary tool (1) coordinate for working. A load detection module (E1) is used to detect a load parameter that is generated when the main tool (4) operates, and send the load parameter to a central control module (E2). The central control module (E2) adjusts output power of the auxiliary tool (1). The central control module (E2) controls power of the auxiliary tool (1) to increase as the load parameter of the main tool (4) increases and decrease as the load parameter decreases. An automatic adjustment function of the auxiliary tool (1) is applied to a dust collector (1). When power of the main tool (4) increases, more dust and scraps are generated, suction of the dust collector (1) is automatically adjusted to be higher, and the demand of a large quantity of dust is satisfied; and when the power of the main tool (4) decreases, less dust and scraps are generated, power of the dust collector (1) automatically decreases, the suction is reduced, and the demand of a small quantity of dust is satisfied.

A dual mounted end-effector system mounted on a motive robot arm for preparing an object surface is described. The system includes a first tool configured to contact and prepare the object surface and a second tool configured to contact and prepare the object surface. The system also includes a force control. The force control is configured to align, in a first state, with the first tool in position to contact and prepare the object surface and, in a second state, with the second tool in a position to contact and prepare the object surface.