Patent classifications
B24B53/047
CMP polishing pad conditioner
A method of processing chemical mechanical polishing (CMP) pad conditioners includes providing the CMP pad conditioner including conditioner substrate that is a metal, ceramic or a metal-ceramic material with a plurality of hard conditioner particles with a Vickers hardness greater than 3,000 Kg/mm.sup.2 bonded to a top surface of the conditioner substrate, and a slurry including an aqueous medium and a plurality of hard slurry particles having a hardness greater than 3,000 Kg/mm.sup.2. The surface of the pad conditioner is polished in a CMP apparatus using a polishing pad. After the polishing each conditioner particle has at least one exposed facet, and the plurality of hard conditioner particles have a maximum average protrusion-to-protrusion flatness (PPF) difference of 20 microns, and a sharpest edge measured by a value of a cutting edge radius (CER) that lies at an edge of the facet for at least 80% of the facets.
CMP polishing pad conditioner
A method of processing chemical mechanical polishing (CMP) pad conditioners includes providing the CMP pad conditioner including conditioner substrate that is a metal, ceramic or a metal-ceramic material with a plurality of hard conditioner particles with a Vickers hardness greater than 3,000 Kg/mm.sup.2 bonded to a top surface of the conditioner substrate, and a slurry including an aqueous medium and a plurality of hard slurry particles having a hardness greater than 3,000 Kg/mm.sup.2. The surface of the pad conditioner is polished in a CMP apparatus using a polishing pad. After the polishing each conditioner particle has at least one exposed facet, and the plurality of hard conditioner particles have a maximum average protrusion-to-protrusion flatness (PPF) difference of 20 microns, and a sharpest edge measured by a value of a cutting edge radius (CER) that lies at an edge of the facet for at least 80% of the facets.
Articles having diamond-only contact surfaces
Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.
Articles having diamond-only contact surfaces
Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.
CONDITIONING OF A SUPERABRASIVE GRINDING TOOL
In a method of machining workpieces in a gear grinding machine with a grinding tool having vitrified-bonded abrasive grains made of a superabrasive material. The grinding tool is first dressed. Subsequently, the dressed grinding tool is conditioned such that a desired wear condition is produced. Thereafter, pre-toothed workpieces are machined using the dressed and conditioned grinding tool. Conditioning prevents undesirable grinding-in behavior of the grinding tool, which can cause thermal damage to the edge zone of the workpiece. Conditioning is performed with a conditioning kinematics, which is different from the machining kinematics and may correspond to a dressing kinematics. For conditioning, a conditioning tool is used which has a basic shape that is different from the basic shape of the workpieces.
CONDITIONING OF A SUPERABRASIVE GRINDING TOOL
In a method of machining workpieces in a gear grinding machine with a grinding tool having vitrified-bonded abrasive grains made of a superabrasive material. The grinding tool is first dressed. Subsequently, the dressed grinding tool is conditioned such that a desired wear condition is produced. Thereafter, pre-toothed workpieces are machined using the dressed and conditioned grinding tool. Conditioning prevents undesirable grinding-in behavior of the grinding tool, which can cause thermal damage to the edge zone of the workpiece. Conditioning is performed with a conditioning kinematics, which is different from the machining kinematics and may correspond to a dressing kinematics. For conditioning, a conditioning tool is used which has a basic shape that is different from the basic shape of the workpieces.
Dresser
A dresser includes: a mount component; and a cutting edge component inserted in the mount component at a base end portion side, wherein the portion of the cutting edge component inserted in the mount component has one or more portions in each of which an area of a cross section is increased from the front end portion side toward the base end portion side in the insertion direction, and a ratio L1/M1 of a length L1 and a maximum value M1 is more than or equal to 2.1, where L1 represents a length of the portion of the cutting edge component inserted in the mount component and M1 represents a maximum value of a diameter of a circle having an area equal to the area of the cross section of the portion of the cutting edge component inserted in the mount component.
Dresser
A dresser includes: a mount component; and a cutting edge component inserted in the mount component at a base end portion side, wherein the portion of the cutting edge component inserted in the mount component has one or more portions in each of which an area of a cross section is increased from the front end portion side toward the base end portion side in the insertion direction, and a ratio L1/M1 of a length L1 and a maximum value M1 is more than or equal to 2.1, where L1 represents a length of the portion of the cutting edge component inserted in the mount component and M1 represents a maximum value of a diameter of a circle having an area equal to the area of the cross section of the portion of the cutting edge component inserted in the mount component.
Single-point diamond dresser for grinding wheel based on acoustic emission online monitoring
The present application discloses a single-point diamond dresser for a grinding wheel based on acoustic emission online monitoring, which includes a support module, an anti-interference module, a compression cooling module and an acoustic emission online monitoring module. An acoustic emission sensor monitors the dressing state of the grinding wheel online; a damping sheet and a damping interlayer greatly reduce external noise interference; a high pressure coolant causes an upward elastic deformation of an elastic spacer and the damping sheet, enlarging a contact force between the acoustic emission sensor and the core and moreover improving a sensitivity of the acoustic emission sensor; the coolant flows through the coolant passages in the core to cool a dressing area; current limiting passages, pressure relief cavities and perforated pressure-relief plates limit flow and reduce a pressure of the coolant, reducing the interference of the coolant on the grinding wheel dressing.
Single-point diamond dresser for grinding wheel based on acoustic emission online monitoring
The present application discloses a single-point diamond dresser for a grinding wheel based on acoustic emission online monitoring, which includes a support module, an anti-interference module, a compression cooling module and an acoustic emission online monitoring module. An acoustic emission sensor monitors the dressing state of the grinding wheel online; a damping sheet and a damping interlayer greatly reduce external noise interference; a high pressure coolant causes an upward elastic deformation of an elastic spacer and the damping sheet, enlarging a contact force between the acoustic emission sensor and the core and moreover improving a sensitivity of the acoustic emission sensor; the coolant flows through the coolant passages in the core to cool a dressing area; current limiting passages, pressure relief cavities and perforated pressure-relief plates limit flow and reduce a pressure of the coolant, reducing the interference of the coolant on the grinding wheel dressing.