A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

A rotary dresser includes a cored bar, an electroformed layer, and superabrasive grains fixed to an outer circumferential surface of the electroformed layer, and a plurality of island regions in which a plurality of superabrasive grains is gathered is provided at certain intervals. Since a plurality of the island regions in which a plurality of the superabrasive grains is gathered is provided at certain intervals, the same degree of dressing accuracy can be obtained as in a case in which expensive large superabrasive grains are fixed at a low density using cheap and small superabrasive grains, it is possible to decrease the contact area of a single superabrasive grain, and favorable cutting quality can be obtained.

A rotary dresser includes a cored bar, an electroformed layer, and superabrasive grains fixed to an outer circumferential surface of the electroformed layer, and a plurality of island regions in which a plurality of superabrasive grains is gathered is provided at certain intervals. Since a plurality of the island regions in which a plurality of the superabrasive grains is gathered is provided at certain intervals, the same degree of dressing accuracy can be obtained as in a case in which expensive large superabrasive grains are fixed at a low density using cheap and small superabrasive grains, it is possible to decrease the contact area of a single superabrasive grain, and favorable cutting quality can be obtained.

There are provided: a linear motion guide device, which enhances workability of raceway surfaces and is capable of reducing production cost; and a production method for the linear motion guide device. For this purpose, a linear motion guide device includes a guide rail (1), a slider (2), and a plurality of rolling elements (4), and the guide rail (1) and the slider (2) individually have raceway surfaces (11, 21), which form a rolling path (3) of the rolling elements (4), at positions opposite to each other. Then, the rolling elements (4) are disposed in the rolling path (3), and the slider (2) moves with respect to the guide rail (1) via the rolling elements (4). The raceway surface (21) of at least one of the slider (2) and the guide rail (1) is composed of: a first raceway surface (21A); and second raceway surfaces (21B) extending on both sides of the first raceway surface (21), and surface roughness of the second raceway surfaces (21B) is set rougher than surface roughness of the first raceway surface (21A).

A method of shaping a cutting blade, includes a modified layer forming step of forming a plurality of modified layers at different heights within a dressing member by irradiating the dressing member with a laser beam having a wavelength transmissible through the dressing member from one surface of the dressing member a plurality of times while a focusing point of the laser beam is positioned within the dressing member, and a blade shaping step of shaping the cutting blade into a predetermined shape formed by the plurality of modified layers by cutting the dressing member by the cutting blade until the cutting blade reaches the modified layers after performing the modified layer forming step.

A method which is executed in a grinding machine comprising a) rotationally driving a cup grinding wheel around an axis of rotation of a tool spindle at a first speed, b) rotationally driving a dressing tool around an axis of rotation of a dressing spindle at a second speed, c) carrying out a dressing method using the dressing tool, wherein a predetermined, fixed speed ratio is specified between the first speed and the second speed, and after steps (a), (b), and (c): i. eccentrically rotationally driving the cup grinding wheel around the axis of rotation of the tool spindle at a first machining speed using the eccentric drive, ii. carrying out a grinding method, wherein the bevel gear workpiece is machined by grinding using the cup grinding wheel.

A method which is executed in a grinding machine comprising a) rotationally driving a cup grinding wheel around an axis of rotation of a tool spindle at a first speed, b) rotationally driving a dressing tool around an axis of rotation of a dressing spindle at a second speed, c) carrying out a dressing method using the dressing tool, wherein a predetermined, fixed speed ratio is specified between the first speed and the second speed, and after steps (a), (b), and (c): i. eccentrically rotationally driving the cup grinding wheel around the axis of rotation of the tool spindle at a first machining speed using the eccentric drive, ii. carrying out a grinding method, wherein the bevel gear workpiece is machined by grinding using the cup grinding wheel.

Provided is a method of chamfer machining a silicon wafer which makes it possible to increase the number of machining operations that can be performed using a chamfering wheel used for helical chamfer machining in the case of obtaining a small finished wafer taper angle. The method in which helical chamfer machining is performed so that the finished wafer taper angle θ of an edge portion in the one silicon wafer is within an allowable angle range of a target wafer taper angle θ.sub.0 includes a first truing step; a first chamfer machining step; a step of determining a groove bottom diameter ϕ.sub.A of the fine grinding grindstone portion; a second truing step using a second truer taper angle α.sub.2; and a second chamfer machining step. The second truer taper angle α.sub.2 is made larger than the first truer taper angle α.sub.1.

A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.