A grinding coolant supplier configured to supply a grinding coolant to a grinder configured to grind an element of a machine part having a rolling element, the grinding coolant supplier including: a grinding coolant generation apparatus configured to generate a grinding coolant which is a mixture of a water-soluble stock coolant, a first reformed water of which water particles have an average particle size of not smaller than 80 nm and not greater than 150 nm, and a second reformed water of which water particles have an average particle size of not smaller than 5 nm and smaller than 80 nm; and grinding coolant supplying device configured to supply the generated grinding coolant to the grinder.

A grinding coolant supplier configured to supply a grinding coolant to a grinder configured to grind an element of a machine part having a rolling element, the grinding coolant supplier including: a grinding coolant generation apparatus configured to generate a grinding coolant which is a mixture of a water-soluble stock coolant, a first reformed water of which water particles have an average particle size of not smaller than 80 nm and not greater than 150 nm, and a second reformed water of which water particles have an average particle size of not smaller than 5 nm and smaller than 80 nm; and grinding coolant supplying device configured to supply the generated grinding coolant to the grinder.

A hand-held power tool includes a housing, a motor, a cooling unit, and a plurality of electronics. The housing includes a first housing part and an air intake opening. The motor is assigned to a drive train of the hand-held power tool. The cooling unit is configured to cool the motor. The plurality of electronics is located in the housing. The first housing part includes at least one air channel that is integral with the first housing part. The air intake opening is configured to conduct a cooling air flow directly to the motor via the at least one air channel.

A hand-held power tool includes a housing, a motor, a cooling unit, and a plurality of electronics. The housing includes a first housing part and an air intake opening. The motor is assigned to a drive train of the hand-held power tool. The cooling unit is configured to cool the motor. The plurality of electronics is located in the housing. The first housing part includes at least one air channel that is integral with the first housing part. The air intake opening is configured to conduct a cooling air flow directly to the motor via the at least one air channel.

An apparatus for edge grinding a glazing comprising a grinding wheel, rotatable about an axis, a groove in a circumference of the wheel and first and second orifices arranged on first and second sides of the plane of the groove, which form first and second jets of coolant directed substantially into the groove on first and second trajectories not in the plane of the groove. A corresponding process for edge grinding causes fewer sharp portions and fewer small fractures in the glazing edge than the prior art. A glazing manufactured by the apparatus or the process has higher edge strength than the prior art.

An apparatus for edge grinding a glazing comprising a grinding wheel, rotatable about an axis, a groove in a circumference of the wheel and first and second orifices arranged on first and second sides of the plane of the groove, which form first and second jets of coolant directed substantially into the groove on first and second trajectories not in the plane of the groove. A corresponding process for edge grinding causes fewer sharp portions and fewer small fractures in the glazing edge than the prior art. A glazing manufactured by the apparatus or the process has higher edge strength than the prior art.

A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.

A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.

The present invention provides a wafer polishing apparatus, including: a surface plate having a polishing pad attached on an upper surface thereof; a slurry injection nozzle configured to inject slurry toward the polishing pad; at least one polishing head configured to accommodate a wafer and rotate at an upper portion of the surface plate; an index configured to support so as to connect the at least one polishing head at an upper portion thereof; and a particle suction part coupled to the index and configured to suck particles generated during polishing of the wafer.

The present invention provides a wafer polishing apparatus, including: a surface plate having a polishing pad attached on an upper surface thereof; a slurry injection nozzle configured to inject slurry toward the polishing pad; at least one polishing head configured to accommodate a wafer and rotate at an upper portion of the surface plate; an index configured to support so as to connect the at least one polishing head at an upper portion thereof; and a particle suction part coupled to the index and configured to suck particles generated during polishing of the wafer.