A pneumatic suction device including a suction nozzle connected to a suction unit and at least one air amplification module located in at least one hose for connecting said suction nozzle to the suction unit. The at least one air amplification module includes at least two air amplifiers operating according to a Coanda effect.

A pneumatic suction device including a suction nozzle connected to a suction unit and at least one air amplification module located in at least one hose for connecting said suction nozzle to the suction unit. The at least one air amplification module includes at least two air amplifiers operating according to a Coanda effect.

A disassembly mechanism configured to be disposed on a dust collector is provided, including: a fixation assembly, including a first fixation portion and a second fixation portion, the first and second fixation portions being configured to be disposed on a base and a barrel of the dust collector respectively, the second fixation portion including a slot; an actuating mechanism, including an engaging portion being disengageably engaged laterally with the slot and a connecting portion being movably disposed on the first fixation portion, and the engaging portion being movable with the second fixation portion. A dust collector including at least one aforementioned disassembly mechanism is also provided.

A dust collecting treatment apparatus is connected to a dry type polishing apparatus, sucks dust-containing air from the dry type polishing apparatus, and separates the dust and the air from each other. The apparatus includes a cylindrical main body connected to the dry type polishing apparatus; a suction box disposed on an upper plate of the cylindrical main body, a suction source connected to the suction box through a ventilating duct, a filter unit that includes a flange section supported on the upper plate of the cylindrical main body, a pipe formed integrally with the flange section and formed of a plurality of minute holes, and a filter formed of a water-soluble material and externally fitted to the pipe in a detachable manner. The filter is disposed inside the cylindrical main body. A water jet nozzle is disposed inside the suction box and jets water into the filter unit.

A dust collecting treatment apparatus is connected to a dry type polishing apparatus, sucks dust-containing air from the dry type polishing apparatus, and separates the dust and the air from each other. The apparatus includes a cylindrical main body connected to the dry type polishing apparatus; a suction box disposed on an upper plate of the cylindrical main body, a suction source connected to the suction box through a ventilating duct, a filter unit that includes a flange section supported on the upper plate of the cylindrical main body, a pipe formed integrally with the flange section and formed of a plurality of minute holes, and a filter formed of a water-soluble material and externally fitted to the pipe in a detachable manner. The filter is disposed inside the cylindrical main body. A water jet nozzle is disposed inside the suction box and jets water into the filter unit.

The invention relates to a grinding machine, which is suitable for a robot-supported grinding process. According to one embodiment, the grinding machine has a housing, a motor arranged in the interior of the housing, a fan wheel arranged on a motor shaft of the motor in the interior of the housing, and a support plate coupled to the motor shaft for receiving a grinding disc. The support plate has openings for intake of grinding dust into the interior of the housing. The grinding machine furthermore has an outlet arranged in a wall of the housing for exhausting the grinding dust out of the interior of the housing and a non-rerun valve arranged in the wall of the housing. The non-return valve enables an to escape from the interior of the housing, but prevents intake of air into the interior of the housing.

The invention relates to a grinding machine, which is suitable for a robot-supported grinding process. According to one embodiment, the grinding machine has a housing, a motor arranged in the interior of the housing, a fan wheel arranged on a motor shaft of the motor in the interior of the housing, and a support plate coupled to the motor shaft for receiving a grinding disc. The support plate has openings for intake of grinding dust into the interior of the housing. The grinding machine furthermore has an outlet arranged in a wall of the housing for exhausting the grinding dust out of the interior of the housing and a non-rerun valve arranged in the wall of the housing. The non-return valve enables an to escape from the interior of the housing, but prevents intake of air into the interior of the housing.

A wafer edge polishing apparatus includes a cleaning mechanism exhibiting a superb effect of cleaning slurry residue adhered on a chuck table. This edge polishing device is provided with: a chuck table which sucks/holds a wafer; a rotation drive mechanism which rotates the chuck table; an edge polishing unit which polishes an edge of the wafer while supplying slurry to the wafer, which is rotating while being sucked/held by the chuck table; and a cleaning unit which removes slurry residue on the chuck table. The cleaning unit includes a cleaning head, and cleans the chuck table through high-pressure cleaning and brush-cleaning by using the cleaning head, wherein the cleaning head is provided with a high-pressure jet nozzle and a brush surrounding the periphery of the high-pressure jet nozzle.

A wafer edge polishing apparatus includes a cleaning mechanism exhibiting a superb effect of cleaning slurry residue adhered on a chuck table. This edge polishing device is provided with: a chuck table which sucks/holds a wafer; a rotation drive mechanism which rotates the chuck table; an edge polishing unit which polishes an edge of the wafer while supplying slurry to the wafer, which is rotating while being sucked/held by the chuck table; and a cleaning unit which removes slurry residue on the chuck table. The cleaning unit includes a cleaning head, and cleans the chuck table through high-pressure cleaning and brush-cleaning by using the cleaning head, wherein the cleaning head is provided with a high-pressure jet nozzle and a brush surrounding the periphery of the high-pressure jet nozzle.

A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable. The dry polishing chamber includes a polishing device on the turntable, and a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the interception filter, and is between the polishing device and the interception filter.