B24B7/245

Polishing liquid, method for manufacturing glass substrate, and method for manufacturing magnetic disk
11680187 · 2023-06-20 · ·

Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, and a difference between D95 and D5 is 3 μm or more.

Method for decoating a glass panel
09744638 · 2017-08-29 · ·

When decoating a glass panel (3), a decoating tool (6) with a circular-cylindrical grinding element (8) is used, which element is set to rotate around its axis. In the end face of the grinding element (8) that is used when the active face (9) is decoated, a hole (10) and at least one radial groove (11) are provided. The decoating tool (6) is placed at a spot (A) on the glass panel (3) in a movement (arrow 13) that is oriented at an acute angle to the plane of the glass panel (3), which lies between the ends (B) and (C) of the strip-shaped decoating area (14) and moves first to the one end (B) (arrow 15) and then to the other end (C) (arrow 16) in order to strip coating from the glass panel (3) in the decoating area (14).

POLISHING LIQUID, METHOD FOR MANUFACTURING GLASS SUBSTRATE, AND METHOD FOR MANUFACTURING MAGNETIC DISK
20220119680 · 2022-04-21 ·

Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, and a difference between D95 and D5 is 3 μm or more.

Polishing liquid, method for manufacturing glass substrate, and method for manufacturing magnetic disk
11214713 · 2022-01-04 · ·

Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, and a difference between D95 and D5 is 3 μm or more.

POLISHING LIQUID AND METHOD FOR MANUFACTURING GLASS SUBSTRATE
20230287244 · 2023-09-14 ·

Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, D100 is 3 μm or more, D50 is 0.8 to 2.4 μm, and Dpeak−D5 is less than D95−Dpeak.

MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME
20200358039 · 2020-11-12 ·

An apparatus for manufacturing a display apparatus includes: a polisher at which a polishing material is supplied to a base member of the display apparatus and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyer to which the polished base member is provided from the polisher and from which the polished base member is transferred to outside the apparatus; and a suction unit corresponding to the conveyer and by which a pressure around the conveyer is provided to be lower than a pressure at remaining portions of the apparatus.

Glass-plate working apparatus
10800697 · 2020-10-13 · ·

A glass-plate working apparatus 1 includes: a scribe line forming device 5, glass-plate bend-breaking devices 15A and 15B, glass-plate peripheral edge grinding devices 19A and 19B, and a glass-plate transporting device 20 for carrying in and carrying out two glass plates 2 at a time with respect to each of the scribe line forming device 5, the glass-plate bend-breaking devices 15A and 15B, and the glass-plate peripheral edge grinding devices 19A and 19B, and X-Y coordinate system controlled movement of the glass-plate peripheral edge grinding devices 19A and 19B in simultaneous grinding of peripheral edges of the glass plates 2 is adapted to be effected independently of each other.

POLISHING LIQUID, METHOD FOR MANUFACTURING GLASS SUBSTRATE, AND METHOD FOR MANUFACTURING MAGNETIC DISK
20200208015 · 2020-07-02 ·

Letting a particle diameter be Dx (m) when a cumulative particle volume cumulated from the small particle diameter side reaches x(%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 m or less, and a difference between D95 and D5 is 3 m or more.

Manufacturing apparatus and method of manufacturing display apparatus using the same

An apparatus for manufacturing a display apparatus includes: a polisher at which a polishing material is supplied to a base member of the display apparatus and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyer to which the polished base member is provided from the polisher and from which the polished base member is transferred to outside the apparatus; and a suction unit corresponding to the conveyer and by which a pressure around the conveyer is provided to be lower than a pressure at remaining portions of the apparatus.

MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME
20240292725 · 2024-08-29 ·

An apparatus for manufacturing a display apparatus includes: a polisher at which a polishing material is supplied to a base member of the display apparatus and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyer to which the polished base member is provided from the polisher and from which the polished base member is transferred to outside the apparatus; and a suction unit corresponding to the conveyer and by which a pressure around the conveyer is provided to be lower than a pressure at remaining portions of the apparatus.