An object of the present invention is to provide a unit capable of improving redispersibility in a concentrated liquid of a polishing composition containing alumina as abrasive grains. There is provided a concentrated liquid of a polishing composition which includes: particulate alumina; colloidal alumina having an aspect ratio of more than 5 and 800 or less; at least one phosphorus-containing acid selected from the group consisting of phosphoric acid, phosphoric acid condensates, organic phosphoric acids, phosphonic acids, and organic phosphonic acids; and water, where a pH of the concentrated liquid of the polishing composition is 2 or more and 4.5 or less.

Rubber composites with regions doped with conductive material, e.g., carbon nanotubes, and patterned regions doped with both conductive material and semiconductive material, e.g., carbon nanotubes and polycrystalline silicon are created with rubbing-in technology. The composites provide for a deformable and elastic composite which maintains semiconductor operations under stress, and can be used for filtering, determining compressive force, and a variety of other applications.

Rubber composites with regions doped with conductive material, e.g., carbon nanotubes, and patterned regions doped with both conductive material and semiconductive material, e.g., carbon nanotubes and polycrystalline silicon are created with rubbing-in technology. The composites provide for a deformable and elastic composite which maintains semiconductor operations under stress, and can be used for filtering, determining compressive force, and a variety of other applications.

Rubber composites with regions doped with conductive material, e.g., carbon nanotubes, and patterned regions doped with both conductive material and semiconductive material, e.g., carbon nanotubes and polcrystalline silicon are created with rubbing-in technology. The composites provide for a deformable and elastic composite which maintains semiconductor operations under stress, and can be used for filtering, determining compressive force, and a variety of other applications.

Rubber composites with regions doped with conductive material, e.g., carbon nanotubes, and patterned regions doped with both conductive material and semiconductive material, e.g., carbon nanotubes and polcrystalline silicon are created with rubbing-in technology. The composites provide for a deformable and elastic composite which maintains semiconductor operations under stress, and can be used for filtering, determining compressive force, and a variety of other applications.

A portable rasping platform for rasping a top surface of a wall panel includes a plurality of adjustable leveling supports, a pair of support rails, and a drum rasp assembly. The drum rasp assembly includes a drum rasp, a motor coupled to the drum rasp and configured to rotate the drum rasp at a suitable speed, and a truss frame supporting the drum rasp and configured to roll along the pair of support rails. The pair of support rails are configured to be positioned on the plurality of adjustable leveling supports arranged in parallel a certain space apart, and the plurality of adjustable leveling supports are configured to support the wall panel. The drum rasp is configured to pass over and treat the top surface of the wall panel as the drum rasp assembly is displaced along the pair of support rails.

A portable rasping platform for rasping a top surface of a wall panel includes a plurality of adjustable leveling supports, a pair of support rails, and a drum rasp assembly. The drum rasp assembly includes a drum rasp, a motor coupled to the drum rasp and configured to rotate the drum rasp at a suitable speed, and a truss frame supporting the drum rasp and configured to roll along the pair of support rails. The pair of support rails are configured to be positioned on the plurality of adjustable leveling supports arranged in parallel a certain space apart, and the plurality of adjustable leveling supports are configured to support the wall panel. The drum rasp is configured to pass over and treat the top surface of the wall panel as the drum rasp assembly is displaced along the pair of support rails.

A method of manufacturing a structure includes: a molding step of impregnating carbon fibers with a resin material and curing the resin material for molding a carbon fiber composite material; a polishing step of polishing a polishing region on a surface of the carbon fiber composite material molded in the molding step, with an abrasive that has a predetermined hardness; and a bonding step of bonding, through an adhesive, another member to a part of the polishing region polished by the polishing step. The molding step forms, in a top layer, a polishing layer that has a hardness which is lower than the predetermined hardness, and forms a surface protective layer that is lower than the polishing layer, protects the carbon fiber composite material from the abrasive, and contains a protective filler having a hardness which is higher than the predetermined hardness.

A method of manufacturing a structure includes: a molding step of impregnating carbon fibers with a resin material and curing the resin material for molding a carbon fiber composite material; a polishing step of polishing a polishing region on a surface of the carbon fiber composite material molded in the molding step, with an abrasive that has a predetermined hardness; and a bonding step of bonding, through an adhesive, another member to a part of the polishing region polished by the polishing step. The molding step forms, in a top layer, a polishing layer that has a hardness which is lower than the predetermined hardness, and forms a surface protective layer that is lower than the polishing layer, protects the carbon fiber composite material from the abrasive, and contains a protective filler having a hardness which is higher than the predetermined hardness.

A wafer processing method includes a liquid supplying step of supplying a liquid to the front side of a wafer, a close contact making step of pressing a protective film against the front side of the wafer with the liquid interposed therebetween, thereby bringing the protective film into close contact with the front side of the wafer, a protective member fixing step of covering the protective film, with a protective member formed from a liquid resin curable by external stimulus, thereby fixing the protective member through the protective film to the front side of the wafer, a grinding step of grinding the back side of the wafer to reduce the thickness of the wafer, and a peeling step of peeling the protective film and the protective member from the wafer thinned by the grinding step.