A probe pin cleaning sheet with cleaning power and a manufacturing method thereof are disclosed, comprising a release layer, a cleaning layer, and a substrate. Thus, in the process that the probe pin pierces the cleaning layer, through the material of cleaning layer, and the cleaning grains of abrasive material contained in the cleaning material in the cleaning layer, the cleaning power is increased to scrape off dirt from the surface of probe pin. In addition, by the negative charges and lipophilic property of the silicone itself, the dirt on the probe pin can be transferred onto the cleaning layer.

A probe pin cleaning sheet with cleaning power and a manufacturing method thereof are disclosed, comprising a release layer, a cleaning layer, and a substrate. Thus, in the process that the probe pin pierces the cleaning layer, through the material of cleaning layer, and the cleaning grains of abrasive material contained in the cleaning material in the cleaning layer, the cleaning power is increased to scrape off dirt from the surface of probe pin. In addition, by the negative charges and lipophilic property of the silicone itself, the dirt on the probe pin can be transferred onto the cleaning layer.

A grinding tool and a manufacturing method thereof are disclosed. The grinding tool includes a plurality of thin teeth (2) which are sequentially spliced and stacked to form an annular structure, wherein every two adjacent thin teeth (2) are fixedly connected, and a groove body (4) is formed between every two adjacent thin teeth (2). The narrower and the more the groove bodies of the grinding tool are, the better the cooling effect is, thus the better the chip-removal effect is. Meanwhile, the manufacturing method for the grinding tool features a machining process having low difficulty and is easy for mass production, thereby facilitating the high-speed and high-efficiency machining of grinding tools with an organic bond and an inorganic bond.

An abrasive article can include a body including a bond material, abrasive particles contained in the bond material, and an impact modifier. In an embodiment, the impact modifier can be in a content of at least 1 vol % of and at most 10 vol % for a total volume of the body. In another embodiment, the impact modifier can include particles having an average particle size (D.sub.50) of at least 10 microns, a particle size D.sub.10 of at least 2 microns, a particles size D.sub.90 of at most 2 mm or any combination thereof.

An abrasive article can include a body including a bond material, abrasive particles contained in the bond material, and an impact modifier. In an embodiment, the impact modifier can be in a content of at least 1 vol % of and at most 10 vol % for a total volume of the body. In another embodiment, the impact modifier can include particles having an average particle size (D.sub.50) of at least 10 microns, a particle size D.sub.10 of at least 2 microns, a particles size D.sub.90 of at most 2 mm or any combination thereof.

Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.

Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.

A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.

The present invention provides a polishing pad that can suppress variations in light transmittance or a polishing pad that can reduce adhesion and sticking of polishing swarf to the surface on the polishing surface side of the light-transmitting resin member (window member).

The present invention provides a polishing pad that can suppress variations in light transmittance or a polishing pad that can reduce adhesion and sticking of polishing swarf to the surface on the polishing surface side of the light-transmitting resin member (window member).