A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.

Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto a porous pad, contacting the substrate with the porous pad while moving the porous pad and substrate relative to one another such that higher portions of the substrate contact the porous pad and lower portions of the substrate do not contact the porous pad, and removing material from the higher portions of the substrate via contact with the porous pad to reduce a height of the higher portions of the substrate relative to the lower portions of the substrate.

An abrasive article with a bonded abrasive body having a ratio of diameter to thickness of at least 10:1. The abrasive article can include secondary abrasive particles contained in a bond material, wherein the secondary abrasive particles include agglomerated primary abrasive particles.

An abrasive article with a bonded abrasive body having a ratio of diameter to thickness of at least 10:1. The abrasive article can include secondary abrasive particles contained in a bond material, wherein the secondary abrasive particles include agglomerated primary abrasive particles.

An abrasive agglomerate particle includes fused aluminum oxide mineral bonded in a vitreous matrix. The fused aluminum oxide mineral is present in a range from 70 percent by weight to 95 percent by weight and the vitreous matrix is present at least at five percent by weight, based on the weight of the abrasive agglomerate particle. The fused aluminum oxide mineral has an average particle size of up to 300 micrometers, and the abrasive agglomerate particle has a frusto-pyramidal shape with side walls having a taper angle in a range from 2 to 15 degrees and a dimension of at least 400 micrometers. The abrasive agglomerate particles are useful in abrasive articles. The method includes contacting the workpiece with an abrasive article and moving the workpiece and the abrasive article relative to each other to abrade the workpiece.

An abrasive agglomerate particle includes fused aluminum oxide mineral bonded in a vitreous matrix. The fused aluminum oxide mineral is present in a range from 70 percent by weight to 95 percent by weight and the vitreous matrix is present at least at five percent by weight, based on the weight of the abrasive agglomerate particle. The fused aluminum oxide mineral has an average particle size of up to 300 micrometers, and the abrasive agglomerate particle has a frusto-pyramidal shape with side walls having a taper angle in a range from 2 to 15 degrees and a dimension of at least 400 micrometers. The abrasive agglomerate particles are useful in abrasive articles. The method includes contacting the workpiece with an abrasive article and moving the workpiece and the abrasive article relative to each other to abrade the workpiece.

The hollow microballoons for CMP polishing pad of the invention are formed of at least one resin selected from the group consisting of a melamine resin, a urea resin and an amide resin and have an average particle size of 1 to 100 μm. According to the invention, there can be provided hollow microballoons for CMP polishing pad, which, when used in CMP polishing pad, exhibit excellent polishing characteristics, and can stably produce CMP polishing pad even in production of CMP polishing pad.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.

The hollow microballoons of the invention are hollow microballoons formed of a resin produced by polymerizing a polymerizing composition that contains a polyrotaxane monomer having at least two polymerizable functional groups in the molecule and a polymerizable monomer other than the polyrotaxane monomer having at least two polymerizable functional groups in the molecule. Using the hollow microballoons of the invention, a CMP polishing pad having excellent polishing characteristics and durability can be provided.