Patent classifications
B25J11/0095
Wafer jig, robot system, communication method, and robot teaching method
A wafer jig according to an embodiment may be used for a robot having a hand including a light emitting part and a light receiving part. The light receiving part detects detection light emitted from the light emitting part. The wafer jig includes a light source for emitting the notification light toward the light receiving part. The wafer jig outputs information to a hand side by emitting the notification light from the light source to the light receiving part.
Robot for simultaneous substrate transfer
Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.
Substrate transfer device
The present application relates to a substrate transfer device, comprising a horizontally arranged cross beam, and support beams longitudinally arranged at two ends of the cross beam, wherein a substrate carrier is suspended on the cross beam, the substrate carrier is located between the two support beams, and the substrate carrier is parallel to a plane where the two support beams are located, the substrate carrier comprises two side walls oppositely arranged in a horizontal direction, and each of the support beams is provided with an auxiliary clamping structure for clamping the substrate carrier during transferring of the substrate carrier.
Transfer Apparatus And Processing System
The present disclosure provides a transfer apparatus and a processing system. The transfer apparatus includes a first transfer assembly configured to transfer a first workpiece to a chamber. The transfer apparatus includes a second transfer assembly configured to transfer a second workpiece from the chamber. The transfer apparatus includes an isolation assembly disposed between the first transfer assembly and the second transfer assembly and configured to isolate energy transfer between the first workpiece and the second workpiece. The transfer apparatus further includes a support assembly configured to restrict the isolation assembly between the first transfer assembly and the second transfer assembly.
Traversing Robot With Multiple End Effectors
An apparatus includes a platform configured to traverse a stationary base along a motion path; a drive coupled to the platform; and a movable arm assembly. The movable arm assembly includes a pivoting base connected to the drive, first and second linkages connected to the pivoting base, each linkage having links connected via rotary joints and each link having at least one end-effector. The platform is configured to traverse the stationary base along a motion path in two opposing directions and the drive and the movable arm assembly are configured to cause independent and simultaneous movement and transfer of substrates from at least one of a first substrate holding area, a second substrate holding area, a third substrate holding area, or a fourth substrate holding area into or from a respective substrate workstation.
Substrate transfer devices, systems and methods of use thereof
The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a robot can include a first mover configured to be driven by a platform of a linear motor, a support structure disposed on the first mover, a first robot arm attached to the first end of the support structure at a shoulder axis, and a first arm drive assembly. The first drive assembly can include a first pulley attached to a first end of the support structure and to the first robot arm at the shoulder axis, a second pulley attached to a second end of the support structure, a first band connecting the first pulley to the second pulley, and a second mover configured to be driven by the platform of the linear motor, where the second mover is connected to the first band, and where motion of the second mover relative to the first mover causes the first band to a) rotate the first pulley and the second pulley and b) rotate the first robot arm around the shoulder axis. Also disclosed are systems and methods incorporating the robot.
SUBSTRATE TRANSPORT APPARATUS
A transfer apparatus including a frame, multiple arms connected to the frame, each arm having an end effector and an independent drive axis for extension and retraction of the respective arm with respect to other ones of the multiple arms, a linear rail defining a degree of freedom for the independent drive axis for extension and retraction of at least one arm, and a common drive axis shared by each arm and configured to pivot the multiple arms about a common pivot axis, wherein at least one of the multiple arms having another drive axis defining an independent degree of freedom with respect to other ones of the multiple arms.
PICK AND PLACE METHOD AND APPARATUS THEREOF
A pick and place method and apparatus thereof are provided. The pick and place method includes: providing at least one semiconductor element disposed on a source storage location; picking up the at least one semiconductor element from the source storage location; transferring the at least one semiconductor element to a temporary storage device according to a signal; positioning the at least one semiconductor element through the temporary storage device; and picking up the positioned semiconductor element from the temporary storage device and placing the positioned semiconductor element on a destination storage location.
Substrate transport device and substrate transporting method
A substrate transport device includes an arm, an end effector coupled to the arm, a driver configured to lift the arm so that the end effector receives a substrate, and a controller configured to control an output of the driver to set a lifting speed of the arm. A difference in height between the end effector and the arm is a position difference. A period from when the end effector contacts the substrate until the end effector completes reception of the substrate is a transition period. The controller sets an upper limit value of the lifting speed that decreases an amplitude of one of acceleration or jerk of the position difference in the transition period as compared to before the transition period to an upper limit value of the lifting speed for the transition period.
Substrate transport with mobile buffer
A transport device in a transport chamber having a reduced pressure atmosphere and including a sidewall extending along an arrangement direction. The transport device includes a first robot fixed at a first robot position in the transport chamber and configured to transfer a substrate to and from a first chamber provided outside the transport chamber, and a second robot fixed at a second robot position in the transport chamber and configured to transfer the substrate to and from a second chamber provided outside the transport chamber on the sidewall. Additionally, the transport device includes a mobile buffer configured to hold the substrate and move along a movement locus extending along the arrangement direction and located between the sidewall and each of the first robot position and the second robot position. The movement locus includes a first position for transferring the substrate to and from the first robot and a second position for transferring the substrate to and from the second robot.