A cutting disc configured to chop food products by rotating about an axis. There are cutting elements which are located on a first side of the cutting disc and which can chop food products by rotating the cutting disc in a first direction of rotation and which are arranged one behind the other when viewed in the first direction of rotation. The cutting elements arranged one behind the other are different.

A cutting disc configured to chop food products by rotating about an axis. There are cutting elements which are located on a first side of the cutting disc and which can chop food products by rotating the cutting disc in a first direction of rotation and which are arranged one behind the other when viewed in the first direction of rotation. The cutting elements arranged one behind the other are different.

A blade removal device removes a blade of a slicer. The removal device has: a base positioned with a contact side on one side of the blade; fasteners supported in the base, rotatable from an attachment position for attaching the blade removal device to the blade into a holding position for holding the blade; and a rotary handle supported on the base and rotatable relative to the base from a closed position into an open position to release an interlock between the blade and the drive. The interlock opens when the rotary handle is in the open position and is closed when the rotary handle is in the closed position. The fasteners in the attachment position engage in cutouts of the rotary handle in the closed position. The cutouts and the fasteners are out of engagement when the rotary handle is in the open position.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Methods, apparatus, and systems for cutting material used in fused deposition modeling systems are provided, which comprise a ribbon including one or more perforations. Material is passed through at least one perforation and movement of the ribbon cuts the material. A further embodiment comprises a disk including one or more blade structures, each forming at least one cavity. Material is passed through at least one cavity and a rotational movement of the disk cuts the material. A further embodiment comprises a slider-crank mechanism including a slider coupled to a set of parallel rails of a guide shaft. The slider moves along a length of the rails to cut the material. Yet another embodiment comprises one or more rotatable blade structures coupled to at least one rod. The rotation of the blade structures causes the blade structures to intersect and cut extruded material during each rotation.

Methods, apparatus, and systems for cutting material used in fused deposition modeling systems are provided, which comprise a ribbon including one or more perforations. Material is passed through at least one perforation and movement of the ribbon cuts the material. A further embodiment comprises a disk including one or more blade structures, each forming at least one cavity. Material is passed through at least one cavity and a rotational movement of the disk cuts the material. A further embodiment comprises a slider-crank mechanism including a slider coupled to a set of parallel rails of a guide shaft. The slider moves along a length of the rails to cut the material. Yet another embodiment comprises one or more rotatable blade structures coupled to at least one rod. The rotation of the blade structures causes the blade structures to intersect and cut extruded material during each rotation.

A slicing machine cuts slices of cutting material. The slicing machine has: a machine housing holding a motor and circular blade driven by the motor; a product feed, which feeds the cutting material to the circular blade; a stop plate; and a slidably arranged carriage, which feeds the cutting material to the blade. The blade is mounted directly on a bearing shaft arranged in the drive motor for the circular blade. The drive motor includes at a stator and rotor, which is detachable from the stator. The stator is in the machine housing. The machine housing has an insertion opening where, in the assembled state, the stator is arranged and through which the rotor is at least partially inserted into the stator. The slicing machine has an attachment device comprising at least one fastener that is configured to fasten the rotor and the stator to the machine housing.

A rotating blade slicer is provided. The slicer includes a housing, a carriage assembly that is slidably movable along the housing with respect to the knife. A gauge plate is provided to set cutting depth. The carriage assembly movably supports a weighted plate that is slidably mounted upon the carriage assembly and is configured to be disposed upon an upper surface of a food product intended to be sliced by the knife. The weighted plate supported by an arm that is slidably mounted to the carriage assembly, wherein the weighted plate is removably attached to the arm such that the weighted plate can be removed from and connected to the arm without any external tools.

A rotating blade slicer is provided. The slicer includes a housing, a carriage assembly that is slidably movable along the housing with respect to the knife. A gauge plate is provided to set cutting depth. The carriage assembly movably supports a weighted plate that is slidably mounted upon the carriage assembly and is configured to be disposed upon an upper surface of a food product intended to be sliced by the knife. The weighted plate supported by an arm that is slidably mounted to the carriage assembly, wherein the weighted plate is removably attached to the arm such that the weighted plate can be removed from and connected to the arm without any external tools.