The present invention relates to a device (1) for separating at least one wafer from a donor substrate (2). The device (1) according to the invention comprises at least a housing (4) with a receiving space (6) for receiving at least one multi-layer arrangement (8) which consists of at least one donor substrate (2) and a receiving layer (10) arranged or generated thereon, and an application device (12) for the contactless application of the multi-layer arrangement (8) for generating crack-conducting stresses in the multi-layer arrangement (8).

A method of cutting or scoring a substrate comprises: providing a substrate which has a maximum of radiation absorption at a first wavelength band; depositing on the substrate, in a predetermined pattern, a heating fluid which has a maximum of radiation absorption at a second wavelength band; and exposing a surface region of the substrate to electromagnetic radiation at the second wavelength band, the surface region including the predetermined pattern, to cut or mark the substrate along the predetermined pattern. The first wavelength band differs from the second wavelength band.

A method of cutting or scoring a substrate comprises: providing a substrate which has a maximum of radiation absorption at a first wavelength band; depositing on the substrate, in a predetermined pattern, a heating fluid which has a maximum of radiation absorption at a second wavelength band; and exposing a surface region of the substrate to electromagnetic radiation at the second wavelength band, the surface region including the predetermined pattern, to cut or mark the substrate along the predetermined pattern. The first wavelength band differs from the second wavelength band.

A method for perforating a film of plastic material in which the film is perforated whilst it is slid through a perforating device by a plurality of pressurised hot gas jets having a temperature above the melting temperature of the main film, in which the hot gas jets are correlated with the sliding speed of the main film, and in which reinforcing bands obtained from an auxiliary film of plastic material are connected to the perforated main film, making the reinforcing bands adhere between parallel rows of base holes. During perforating, the main film of plastic material is pressed against a perforating template, making the main film of plastic material instantaneously penetrate openings of the perforating template by said hot gas jets. A hot gas perforating device and a suitable apparatus for perforating and stretching a film of plastic material are also provided.

A method for perforating a film of plastic material in which the film is perforated whilst it is slid through a perforating device by a plurality of pressurised hot gas jets having a temperature above the melting temperature of the main film, in which the hot gas jets are correlated with the sliding speed of the main film, and in which reinforcing bands obtained from an auxiliary film of plastic material are connected to the perforated main film, making the reinforcing bands adhere between parallel rows of base holes. During perforating, the main film of plastic material is pressed against a perforating template, making the main film of plastic material instantaneously penetrate openings of the perforating template by said hot gas jets. A hot gas perforating device and a suitable apparatus for perforating and stretching a film of plastic material are also provided.

A method of bonding a first part on a second part made of composite material by an adhesive, in which the adhesive is filled with elements of shape memory alloy, is provided. A method of un-sticking the first part adhesively bonded on the composite material second part is also provided. The un-sticking method includes a step of weakening the adhesive interface that consists in subjecting the adhesively bonded parts to heat treatment performed at a temperature that is lower or higher than the martensitic transformation temperature of the shape memory alloy elements.

A method of bonding a first part on a second part made of composite material by an adhesive, in which the adhesive is filled with elements of shape memory alloy, is provided. A method of un-sticking the first part adhesively bonded on the composite material second part is also provided. The un-sticking method includes a step of weakening the adhesive interface that consists in subjecting the adhesively bonded parts to heat treatment performed at a temperature that is lower or higher than the martensitic transformation temperature of the shape memory alloy elements.

A method for separating a first mechanical part from a second mechanical part is described, wherein the second mechanical part is bonded to the first mechanical part by an adhesive film along a connecting area, the first mechanical part having a first specific thermal conductivity and the second mechanical part having a second thermal conductivity that is higher than the first thermal conductivity. The method includes at least one cooling step during which the second mechanical part is cooled to a negative temperature and at least one stressing step during which the second mechanical part is subjected to mechanical stress in order to cause the adhesive film to break.

A method for separating a first mechanical part from a second mechanical part is described, wherein the second mechanical part is bonded to the first mechanical part by an adhesive film along a connecting area, the first mechanical part having a first specific thermal conductivity and the second mechanical part having a second thermal conductivity that is higher than the first thermal conductivity. The method includes at least one cooling step during which the second mechanical part is cooled to a negative temperature and at least one stressing step during which the second mechanical part is subjected to mechanical stress in order to cause the adhesive film to break.

A method for separating a first mechanical part from a second mechanical part is described, wherein the second mechanical part is bonded to the first mechanical part by an adhesive film along a connecting area, the first mechanical part having a first specific thermal conductivity and the second mechanical part having a second thermal conductivity that is higher than the first thermal conductivity. The method includes at least one cooling step during which the second mechanical part is cooled to a negative temperature and at least one stressing step during which the second mechanical part is subjected to mechanical stress in order to cause the adhesive film to break.