A wood or engineered wood structural panel, such as, but not limited to, OSB (“oriented strand board”) or plywood, that is both fire-resistant and water resistant. The panel is factory-coated with a product that provides fire resistance. The treatment gives it a Fire-Resistant (FR) performance (for use in a one- or two-hour rated assembly). The panel also is overlaid or coated in a factory setting with a weather/water resistive barrier (WRB). The structural panel thus combines a fire-resistant structural sheathing and WRB product in one integrated panel produced at a factory prior for installation at a job site.

A sugar-based binder composition for manufacturing a composite product, notably a wood board, comprises at least one further particulate additive selected from the group consisting of:—particulate additive(s) having a BET specific surface area which is ≥50 m.sup.2/g;—amorphous silica particles;—fumed silica particles; and—untreated fumed silica particles.

A sugar-based binder composition for manufacturing a composite product, notably a wood board, comprises at least one further particulate additive selected from the group consisting of:—particulate additive(s) having a BET specific surface area which is ≥50 m.sup.2/g;—amorphous silica particles;—fumed silica particles; and—untreated fumed silica particles.

The invention relates to an insulated panel, in particular a wall panel or roof panel, including a foamed core layer and a cover layer affixed to the foamed core layer. The invention also relates to an insulating covering, in particular a wall covering or floor covering, including a plurality said insulated panels.

An amorphous polylactic acid polymer having a weight average molecular weight in the range of about 35,000 to 180,000 is described. The polylactic acid polymer composition can be hammer milled without cryogenics result in the form of particles wherein 90% of the particles have particle size of about 250 μm or less and the material has a glass transition temperature of between about 55° C. to about 58° C. and a relative viscosity of about 1.45 to about 1.95 centipoise. The polymer composition can be used to form an aqueous suspension. The material is ideally suited for use in preparing particleboard. A method is disclosed for preparing such polylactic acid polymers. The method involves obtaining an amorphous polylactic acid polymer having a weight average molecular weight of between about 115,000 to about 180,000. Treating the polylactic acid polymer to reduce the molecular weight to between about 35,000 to 45,000 such that it has a glass transition temperature of between about 55° C. and 58° C. and a relative viscosity of about 1.45 to about 1.95. Material can be formed into particles in a commercial hammer mill with bypass such that 90% of the initial mass results in the particles which can pass thru a sieve having a pore size of about 250 μm. During particle board formation the temperature of around 140-140 C being reached to optimally activate the adhesive; Bond strengths and throughput rates of resulting particle boards can be controlled thereafter, with variable combination of particle sizes, adhesive loading and initial moisture content.

An amorphous polylactic acid polymer having a weight average molecular weight in the range of about 35,000 to 180,000 is described. The polylactic acid polymer composition can be hammer milled without cryogenics result in the form of particles wherein 90% of the particles have particle size of about 250 μm or less and the material has a glass transition temperature of between about 55° C. to about 58° C. and a relative viscosity of about 1.45 to about 1.95 centipoise. The polymer composition can be used to form an aqueous suspension. The material is ideally suited for use in preparing particleboard. A method is disclosed for preparing such polylactic acid polymers. The method involves obtaining an amorphous polylactic acid polymer having a weight average molecular weight of between about 115,000 to about 180,000. Treating the polylactic acid polymer to reduce the molecular weight to between about 35,000 to 45,000 such that it has a glass transition temperature of between about 55° C. and 58° C. and a relative viscosity of about 1.45 to about 1.95. Material can be formed into particles in a commercial hammer mill with bypass such that 90% of the initial mass results in the particles which can pass thru a sieve having a pore size of about 250 μm. During particle board formation the temperature of around 140-140 C being reached to optimally activate the adhesive; Bond strengths and throughput rates of resulting particle boards can be controlled thereafter, with variable combination of particle sizes, adhesive loading and initial moisture content.

The invention relates to a device for the gluing of particles, in particular wood particles, including a dryer and a line transporting the stream of particles, wherein the stream of particles is being introduced in a main flow direction into the dryer via the outlet. A binder is supplied to the stream of particles, said binder being introduced via a nozzle device with a speed component directed against the main flow direction.

The invention relates to a device for the gluing of particles, in particular wood particles, including a dryer and a line transporting the stream of particles, wherein the stream of particles is being introduced in a main flow direction into the dryer via the outlet. A binder is supplied to the stream of particles, said binder being introduced via a nozzle device with a speed component directed against the main flow direction.

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of a crosslinker and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.