An ultrasonic resonator support structure 10 including a holder 17 supports an ultrasonic resonator 16 at both sides such that the ultrasonic resonator 16 is rotatable to the holder 17. The ultrasonic resonator 16 includes an ultrasonic horn 13 with a machining tool 12 attached, and a first booster 14 and a second booster 15 coaxially fixed one by one to both ends in the axial directions of the ultrasonic horn 13. The holder 17 has a rolling bearing mechanism 18 that rotatably supports the first booster 14 side of the ultrasonic resonator 16 and a gas bearing mechanism 19 that rotatably supports the second booster 15 side of the ultrasonic resonator 16.

There is provided a blade replacing apparatus for replacing a cutting blade. The blade replacing apparatus includes a blade storage unit including a movable storage section configured to store the cutting blade, a transporting unit including a holding unit configured to hold the cutting blade and a moving mechanism configured to move the holding unit, a camera configured to photograph the holding unit, and a control unit including an operation control section configured to control operation of the blade storage unit and the transporting unit and a position registration section in which positions of the storage section and the holding unit. The storage section includes a first mark portion photographable by the camera, and the holding unit includes a second mark portion photographable by the camera.

An ultrasonic resonator support structure including a holder supports an ultrasonic resonator at both sides such that the ultrasonic resonator is rotatable to the holder. The ultrasonic resonator includes an ultrasonic horn with a machining tool attached, and a first booster and a second booster coaxially fixed one by one to both ends in the axial directions of the ultrasonic horn. The holder has a rolling bearing mechanism that rotatably supports the first booster side of the ultrasonic resonator and a gas bearing mechanism that rotatably supports the second booster side of the ultrasonic resonator.

There is provided a blade replacing apparatus for replacing a cutting blade. The blade replacing apparatus includes a blade storage unit including a movable storage section configured to store the cutting blade, a transporting unit including a holding unit configured to hold the cutting blade and a moving mechanism configured to move the holding unit, a camera configured to photograph the holding unit, and a control unit including an operation control section configured to control operation of the blade storage unit and the transporting unit and a position registration section in which positions of the storage section and the holding unit. The storage section includes a first mark portion photographable by the camera, and the holding unit includes a second mark portion photographable by the camera.

The invention discloses a method for cutting a substrate wafer from an indium phosphide crystal, and belongs to the field of semiconductor substrate preparation, comprises the following steps of: 1) orientating, cutting the head and the tail of a crystal bar, adjusting the orientation and trying to cut the crystal bar until a wafer with a required crystal orientation cut, wherein the cutting end face is an orientation end face; 2) multi-wire cutting, on a multi-wire cutting apparatus, dividing a crystal bar parallel to an orientation end face into wafers; 3) cleaning, cleaning the wafer until no residue and no dirt existing on the surface; 4) circle cutting, performing circle cutting on the wafer to cut the desired crystal orientation area. According to the technical scheme, for the indium phosphide crystal bar which is difficult to control in diameter and easy to twinning/ poly in the growth process, a barreling process which may grind and remove a large amount of InP materials is abandoned, the crystal bar is multi-wire cut into a wafer, and then the substrate wafer which is available in the crystal direction close to the standard size is cut from the wafer to the maximum extent, so that the wafer output can be greatly increased, and the material loss and the waste can be reduced.

An inspection substrate for use in inspecting whether or not a constituent element of a cutting apparatus forms a scratch on a top surface of a workpiece when a cutting blade cuts the workpiece, the inspection substrate includes a top surface side of the inspection substrate having a groove portion for simulated cutting, the groove portion having a width that the cutting blade can pass through, and a paint layer disposed on the top surface side of the inspection substrate to improve visibility of a scratch formed on the top surface side.

To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).

Provided are a silicon ingot slicing apparatus capable of slicing silicon ingots in various forms such as blocks or wafers using microbubbles and wire electric discharge machining.

A method for fabricating MAS NMR rotors and drive caps made of diamond to increase the maximum achievable spinning frequency and enhance MAS NMR sensitivity and resolution. Diamond is an excellent choice for making MAS NMR rotors due to its high tensile and flexural strength, however, micromachining diamond is difficult due to its hardness. Although laser cutting is often employed to cut diamond sheets, this process cannot be used to create the high aspect ratio and small features required for MAS NMR rotors. In the present invention, a laser micromachining process is used to create the desired high aspect ratio while maintaining the small lateral features. In this process, the laser is used to first convert the diamond into graphite followed by a conversion to carbon dioxide in the presence of oxygen. To create a rotor, a rectangular log has a center hole drilled by the laser, and is then micromachined into a hollow cylinder.

A cutting blade mounting method of sandwiching both side surfaces of an annular cutting blade by a first flange and a second flange, the first flange being mounted on an end of a spindle and having a suction hole sucking and holding a side surface of the cutting blade to a sandwiching surface of the first flange, includes: a cutting blade provisional holding step of sucking and holding the cutting blade to the first flange by making the cutting blade abut against the sandwiching surface of the first flange at a perfect circle position at which a center of the cutting blade coincides with an axis of the spindle, and making a suction force act on the suction hole; and a fixing step of fixing the cutting blade maintaining the perfect circle position in the cutting blade provisional holding step to the first flange by the second flange.