A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.

The present invention aims at eliminating a need for a moving mechanism that moves a machining table and eliminating a need for a protective cover such as a bellows cover, and includes a machining table that holds a workpiece, a machining mechanism that machines the workpiece with a rotary tool while using a machining liquid, and a moving mechanism that linearly moves the machining mechanism at least in each of X and Y directions on a horizontal plane, in which the machining mechanism moved by the moving mechanism machines the workpiece with respect to the machining table, the machining table being fixed at least in the X and Y directions.

A cutting apparatus includes a cutting unit cutting a workpiece held on a chuck table, a processing-feed unit moving the chuck table, a moving unit moving the cutting unit, and a delivery pad delivering the workpiece to be cut to the chuck table and delivering the workpiece that has been cut on the chuck table. The delivery pad is mountable on and detachable from the moving unit, holds the workpiece under suction while being mounted on the moving unit, and delivers the workpiece by being moved by the moving unit while holding the workpiece under suction.

A wafer processing method includes preparing a holding table having a blade clearance portion formed therein so as to correspond to a notch of a wafer, holding the wafer by the holding table so as to make the notch of the wafer correspond to the blade clearance portion of the holding table, reducing the diameter of the wafer by cutting the wafer by a cutting blade along an outer peripheral edge of the wafer in a state in which an end of the cutting blade is positioned below the holding surface of the holding table and therefore removing at least a part of the notch portion, and forming a second notch in the wafer by cutting the wafer in a thickness direction by the cutting blade along the blade clearance portion of the holding table.

A processing apparatus includes a holding table for holding a workpiece, a cutting unit including a spindle and a mount, a blade changer unit for mounting a cutting blade on or dismounting a cutting blade from the mount, and a control unit. The blade changer unit includes a blade chuck for holding the cutting blade and a moving unit. The cutting unit includes a vibration detecting sensor. The control unit includes a calculator for calculating the central axis of the mount from a position where the vibration detecting sensor detects vibrations caused upon contact between the mount and the blade chuck, and a mounting/dismounting controller for aligning the central axis of the blade chuck with the central axis of the mount and mounting the cutting blade on and dismounting cutting blade from the mount.

A processing apparatus includes a holding table for holding a workpiece, a cutting unit including a spindle and a mount, a blade changer unit for mounting a cutting blade on or dismounting a cutting blade from the mount, and a control unit. The blade changer unit includes a blade chuck for holding the cutting blade and a moving unit. The cutting unit includes a vibration detecting sensor. The control unit includes a calculator for calculating the central axis of the mount from a position where the vibration detecting sensor detects vibrations caused upon contact between the mount and the blade chuck, and a mounting/dismounting controller for aligning the central axis of the blade chuck with the central axis of the mount and mounting the cutting blade on and dismounting cutting blade from the mount.

A wafer processing method includes preparing a holding table having a blade clearance portion formed therein so as to correspond to a notch of a wafer, holding the wafer by the holding table so as to make the notch of the wafer correspond to the blade clearance portion of the holding table, reducing the diameter of the wafer by cutting the wafer by a cutting blade along an outer peripheral edge of the wafer in a state in which an end of the cutting blade is positioned below the holding surface of the holding table and therefore removing at least a part of the notch portion, and forming a second notch in the wafer by cutting the wafer in a thickness direction by the cutting blade along the blade clearance portion of the holding table.

A cutting apparatus includes a cutting unit cutting a workpiece held on a chuck table, a processing-feed unit moving the chuck table, a moving unit moving the cutting unit, and a delivery pad delivering the workpiece to be cut to the chuck table and delivering the workpiece that has been cut on the chuck table. The delivery pad is mountable on and detachable from the moving unit, holds the workpiece under suction while being mounted on the moving unit, and delivers the workpiece by being moved by the moving unit while holding the workpiece under suction.

A sample preparation saw has a base, a housing, a saw assembly mounted to the base, a dressing assembly, a sample clamping assembly mounted to the base, and a reservoir assembly. The saw assembly includes a blade assembly with a rotating blade. The blade assembly is movable along x-, y- and z-axes by at least two drives. The dressing assembly is operable to dress the rotating blade. The sample clamping assembly includes a rail, a sample mount removably positioned on the rail and a saddle operable to hold a sample. The reservoir assembly is operable to recirculate a rinse fluid sprayed on the rotating blade, and includes a basin having a pump and a series of weirs.

A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.