In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.

In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.

Machine tool, comprising a base (1) with a bottom (10) and a peripheral wall (11) of predetermined height to delimit an internal volume of predetermined capacity and open at the top, in which on the upper edge of said wall (11) is placed, removably, a pierced cover (2), or a work-piece carrier surface provided with through holes (20) through which a refrigerant liquid is free to fall, and wherein an electric motor (4), on which is engaged a tool holder (7), is placed in said inner volume, and wherein said electric motor (4) is inserted in a protection chamber (5) which protects it from the refrigerant liquid passing through said holes (20). The electric motor (4) is connected to corresponding lowering and lifting means, by means of which the tool holder (7) is lowered and raised accordingly, so producing the lifting and lowering of a respective tool (3) through the cover (2).

A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.

Machine tool, comprising a base (1) with a bottom (10) and a peripheral wall (11) of predetermined height to delimit an internal volume of predetermined capacity and open at the top, in which on the upper edge of said wall (11) is placed, removably, a pierced cover (2), or a work-piece carrier surface provided with through holes (20) through which a refrigerant liquid is free to fall, and wherein an electric motor (4), on which is engaged a tool holder (7), is placed in said inner volume, and wherein said electric motor (4) is inserted in a protection chamber (5) which protects it from the refrigerant liquid passing through said holes (20). The electric motor (4) is connected to corresponding lowering and lifting means, by means of which the tool holder (7) is lowered and raised accordingly, so producing the lifting and lowering of a respective tool (3) through the cover (2).