The invention relates to a polymeric film for coating plastics mouldings with a coating material, the polymeric film comprising an adhesion-modified layer and also a layer of the coating material; where the polymeric film together with the adhesion-modified layer and the layer of the coating material is formable at room temperature; where the coating material wholly or partly covers the adhesion-modified layer; and where the adhesion-modified layer has a layer thickness of at least 0.1 μm; and where the adhesion-modified layer is in direct contact with the coating material. The invention further relates to uses of the polymeric film of the invention, to methods for its production and to methods for coating components using the polymeric film of the invention.

In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.

A method and a device (20) for decorating an injection-molded part (40), and an injection-molded part (40). The method for decorating an injection-molded part (40) includes the following steps, which are in particular carried out in the following order: a) providing a transfer film in the form of a roll (10) b) cutting the transfer film to size to form at least one label (30, 11) c) laying the at least one label (30) in an injection-molding apparatus (21) by means of a robot arm (24, 12) d) closing the injection-molding apparatus (21, 13) e) back-injection molding the at least one label (30) by means of an injection-molding compound (14) f) opening the injection-molding apparatus (21) and removing the injection-molded part (40, 15).

The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed. The invention also relates to a partial encapsulated electronic component as produced with such a method.

The purpose of the present invention is to make it possible to shorten the time required for a burr removal step and make it difficult for the burrs to detach from a sheet member in a step for removing the burrs together with the sheet member. For removal, by making the burrs to adhere to a pliable sheet member such as paper or nonwoven fabric that has been incorporated beforehand in the molding die and stripping the sheet member from the molding die, the burrs are removed together with the sheet member. The present invention is characterized in that in order to make it difficult for the burrs to detach from the sheet member during the stripping, a radiused shape with an arc-shaped cross-section is formed by the molding die on the areas surrounding the sections where the burrs adhere to the sheet member.

A single core pin assembly (10) having a first core pin (12) and at least one second core pin (14), the first core pin (12) having a first end (16), a second end (18) and a first core pin body (20). The first core pin body (20) connects the first end (16) and the second end (18). The second core pin (14) has a first end (24), a second end (26), and a second core pin body (28) connecting the second core pin first end (24) and the second core pin second end (26). The second core pin first end (24) is configured to join with the first core pin first end (16) to form a common downstream channel (30). The core pin (10) may be placed in a mold and surrounded by a flowable material (e.g. plastic) to form a work piece.

A component with a customized exterior surface and a method and tool for manufacturing the same are provided. The component may be formed via a plastic forming process with a forming tool, such that it has a surface texture formed on its exterior surface. The forming tool has at least one tool surface, which defines a mold cavity. The tool surface has a textured layer coupled thereto, such that the textured layer directly contacts a moldable material supplied to the mold cavity. The textured layer has a surface texture formed thereon resulting in the surface texture present on the textured layer being transferred to and formed on the exterior surface of the component during forming. The textured layer may be changeable or replaceable with respect to the at least one tool surface, such that a single tool may form components with different surface textures formed on the exterior surface thereof.

A method for manufacturing a structured insert (10) for a mold for manufacturing a timepiece or jewelry component, for example a bracelet strand, including: —providing (E1) a template element (50) comprising a structured surface (51) with a pattern to be reproduced on a surface of a timepiece component; —covering (E2) the structured surface (51) of the template element (50) with a molding resin capable of reproducing a negative pattern of the pattern of the structured surface, and leaving the molding resin to solidify in order to obtain a structured insert (10); —separating (E3) the structured insert (10) from the template element (50), the structured insert (10) comprising a surface comprising the negative pattern; —optionally, cutting the structured insert (10) to the format corresponding to at least part of the timepiece component to be manufactured.

A multi-layered sheet includes a substrate sheet and a thermally curable layer that is disposed on a surface of the substrate sheet and can be disposed on at least a part of a surface of a mold resin, wherein the thermally curable layer is an uppermost layer of the multi-layered sheet, the thermally curable layer includes a product of active energy ray-curable resin cured or half-cured by active energy ray, and the thermally curable layer has: a thermally reactive group that can react and thermally cure with a material component of the mold resin; and a polysiloxane chain.

A package of a heat-bent polarizing sheet for producing an injection-molded polarizing lens and an injection-molded polarizing lens that uses said sheet is provided. The heat-bent polarizing sheet is cumulatively packaged by a non-adhesive isolation film so as to withstand moisture and then stored or transported and can be used in injection molding without performing preliminary drying as a pretreatment of injection molding and without substantial protective-film removal work.