Patent classifications
B29C2045/2638
REPLACEABLE MOLD PART
A replaceable mold part according to the present invention comprises: a depressed portion remained near a cavity; and a detachable portion, the detachable portion having a marking portion or a gas-releasing function, and being caught by a catch mechanism within the depressed portion. When a magnet is brought into proximity of the detachable portion through the cavity and an external magnetic field is applied, a magnet support portion's position is shifted from the fixed location to the released location within the depressed portion so that the catch mechanism of the detachable portion by the depressed portion is switched from the fixed state to the released state, thereby the detachable portion can easily be removed from the depressed portion through the cavity.
Microstructured nozzle and production thereof
The invention relates to a nozzle for use in a device for administering a liquid medical formulation, to a method for producing the nozzle in the form of a microfluidic component and to a tool for producing microstructures of the microfluidic component. The nozzle is formed by a plastics plate with groove-like microstructures which are covered by a plastics cover on the longitudinal side in a fixed manner. The production method includes a moulding process in which a moulding tool is used, which moulding tool has complementary metal microstructures which have been produced from a semiconductor material in an electrodeposition process by means of a master component.
MICROSTRUCTURED NOZZLE AND PRODUCTION THEREOF
The invention relates to a nozzle for use in a device for administering a liquid medical formulation, to a method for producing the nozzle in the form of a microfluidic component and to a tool for producing microstructures of the microfluidic component. The nozzle is formed by a plastics plate with groove-like microstructures which are covered by a plastics cover on the longitudinal side in a fixed manner. The production method includes a moulding process in which a moulding tool is used, which moulding tool has complementary metal microstructures which have been produced from a semiconductor material in an electrodeposition process by means of a master component.