A semiconductor device of embodiments includes: a die pad; a semiconductor chip fixed on the die pad; and a sealing resin covering the semiconductor chip and at least a part of the die pad. The sealing resin has a first protruding portion provided on one side surface and a second protruding portion provided on another side surface. The cross-sectional area of the first protruding portion is equal to or more than 10% of the maximum cross-sectional area of the sealing resin. The cross-sectional area of the second protruding portion is equal to or more than 10%; of the maximum cross-sectional area. The maximum cross-sectional area is equal to or more than 6 mm.sup.2.

Apparatus and method for performing an injection molding cycle using the apparatus where the apparatus comprises: a manifold, a pneumatic actuator driven by a pneumatic valve assembly, the actuator driving a valve pin between a gate closed position and a maximum injection fluid flow position, the pneumatic valve assembly having a spool supported within a cylinder driven by a drive device that is supported solely by and translates together with the spool, a controller that instructs the pneumatic valve assembly to cause the actuator to drive the valve pin either upstream or downstream to selected positions or at selected velocities during the course of a single injection cycle based on a feedback signal indicative of position of the pin or actuator or pressure of an injection fluid material.

An apparatus for controlling the rate of flow of mold material to a mold cavity, the apparatus comprising: an injection molding machine and a manifold; an actuator interconnected to a valve pin having a tip end; a valve system in fluid communication with the actuator to drive the actuator at one or more rates of travel, the valve system having a start position, one or more intermediate drive rate positions and a high drive rate position, the start position holding the valve pin in a gate closed position; a controller that instructs the valve system to move from the start position to the one or more intermediate drive rate positions and to remain in the one or more intermediate drive rate positions for one or more corresponding predetermined amounts of time.

An apparatus for controlling the rate of flow of a fluid mold material comprising: a manifold, an actuator interconnected to a valve pin, a position sensor that senses position of the valve pin, a controller that controls movement of the actuator according to instructions that instruct the actuator to drive the valve pin upstream at one or more selected intermediate velocities in response to receipt by the controller of a signal from the position sensor that the valve pin is disposed in the one or more intermediate upstream gate open positions.

A method and apparatus for performing an injection molding cycle comprising drivably interconnecting a valve pin to an electric motor actuator and controllably operating the electric motor to drive the valve pin at one or more reduced rates of upstream or downstream travel based on either detection of the position of the pin or actuator or on a preselected length of time at which to drive the valve pin.

Injection molding apparatuses and methods wherein a valve pin is controllably driven upstream and downstream along an axis between a first closed position where the tip end of the valve pin obstructs the gate to prevent the injection fluid from flowing into the cavity, a full open position and one or more intermediate positions, wherein the valve pin is drivable to be disposed or held in a selected intermediate position for a selected period of time during the course of an injection cycle where the tip end of the valve pin restricts flow of injection fluid through the gate to the mold cavity.

Injection molding apparatuses and methods wherein a valve pin is controllably driven upstream and downstream along an axis between a first closed position where the tip end of the valve pin obstructs the gate to prevent the injection fluid from flowing into the cavity, a full open position and one or more intermediate positions, wherein the valve pin is drivable to be disposed or held in a selected intermediate position for a selected period of time during the course of an injection cycle where the tip end of the valve pin restricts flow of injection fluid through the gate to the mold cavity.

An injection molding system for implementing a molding process, comprising: a mold, a controller, a position sensor, wherein during an injection cycle, the system feeds the fluid material to one or more nozzles at one or more predetermined times, the controller being configured to receive and process the output signal from the position sensor to determine one or more actual flow rate indicative parameters, a user interface that displays one or more pin positions and one or more flow rate indicative parameters by which a user of the system can track the one or more pin positions and flow rate indicative parameters in real time during the injection cycle.

Injection molding apparatuses and methods wherein a valve pin is controllably driven upstream and downstream along an axis between a first closed position where the tip end of the valve pin obstructs the gate to prevent the injection fluid from flowing into the cavity, a full open position and one or more intermediate positions, wherein the valve pin is drivable to be disposed or held in a selected intermediate position for a selected period of time during the course of an injection cycle where the tip end of the valve pin restricts flow of injection fluid through the gate to the mold cavity.

A method and apparatus for performing an injection molding cycle comprising drivably interconnecting a valve pin to an electric motor actuator and controllably operating the electric motor to drive the valve pin at one or more reduced rates of upstream or downstream travel based on either detection of the position of the pin or actuator or on a preselected length of time at which to drive the valve pin.