In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.

The invention relates to a method for producing a trim part (10) for vehicles, using an injection mold (1), in which an edge of a carrier substrate is formed by the surface cover layer (8) reaching around said edge by means of a lost seal molded to the carrier substrate.

An insert molding component includes a primary molding section with a concave portion formed on one surface thereof, an insert component disposed on a bottom side of the concave portion of the primary molding section, a heat-insulating component disposed in the concave portion of the primary molding section and disposed on a top of the insert component, and a secondary molding section disposed in contact with the one surface of the primary molding section.

A method of manufacturing an electronic component having a housing with terminals insert-molded thereon. Each of the terminals includes a tapered portion having a tapered width and an extension extending from the tapered portion. A mold defining a cavity includes an upper die and sliding dies. After positioning the extension in one of grooves formed in one surface of each of the sliding dies, sliding the sliding dies relative to the extension to make tip edges of opposite side surfaces of the groove facing the cavity abut against opposite side surfaces of the tapered portion; and performing molding while keeping the upper die in close contact with the one surface, and keeping part of the tapered portion and the extension ying in the groove held between a bottom surface of the groove and the upper die with a remaining portion of the tapered portion lying in the cavity.

A system for overmolding an encapsulation at a perimeter region of a glass window panel includes a mold having a fixed part and a first movable part, and a second movable part. Each of the fixed part and the second movable part has a seal disposed thereat. The fixed part and the first and second movable parts cooperate to receive and support a glass window panel and to define a seal cavity. The second movable part includes an elastomeric or rubber or VITON strip that engages a surface of the glass window panel during overmolding of an encapsulation at the perimeter region of the glass window panel.

A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.

An improved mechanism for retaining screws for a conduit body cover is disclosed. The screws are retained by a layer of PVC lining the inner surface of holes in the cover.

A method for producing a laminated glass with a resin frame includes a disposing step of disposing a laminated glass inside a shaping mold in which a cavity into which a resin material for a resin frame is injected is formed, an injection step of injecting the resin material into the cavity from a first surface side of the laminated glass or an end face side of the laminated glass, a blocking step of blocking a flow of the resin material in at least a part of a peripheral portion of the laminated glass to prevent the resin material from reaching an outer peripheral region on a second surface opposite to the first surface, and an opposing force applying step of applying an opposing force from an opposing force applying position on the second surface and inside of the outer peripheral region of the laminated glass.

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

A method for fabrication of a lab-on-a-chip system makes use of first and second mold parts, which are adapted to join each other to form a cavity to accommodate a positioning means and a support structure. The method includes receiving the chip in the positioning means, forming the cavity by joining the first and second mold parts, securing the chip with a fluid port of the chip to rest on the support structure for the support structure to mask the fluid port, introducing a molding material into the cavity to over-mold at least part of the chip and a volume extending away from the chip, separating the first and second mold parts, and extracting the chip from the mold. A fluid channel is formed by the support structure.