A power module having electrical connection parts, preferably made of metal, each having a main plate, the main plates extending in one and the same main plane so as to be substantially coplanar. At least one of the electrical connection parts includes at least one electrical connector projecting from its main plate. At least one transistor is electrically connected between two upper faces of respectively two of the main plates, and an electrically insulating overmolding, for example made of resin, covers each transistor and at least one portion of the upper faces of the main plates.

According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part enhancing the strength at a position where fatigue is concentrated by an enhancing injection material injected into the injection molding mold is formed in the frame.

A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.

The present invention relates to a mould for encapsulating a carrier with electronic components, comprising: at least two mould parts, one of which with at least one mould cavity recessed into a contact side for enclosing electronic components placed on a carrier, and a feed channel for moulding material recessed into the contact surface of the mould part provided with the mould cavity. The invention also relates to a moulding apparatus, a method for at least partially encapsulating a carrier with electronic components and a carrier with electronic components encapsulated with moulding material.

A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.

A tire monitoring system may include first and second sensor elements, a circuit board, and a housing. The circuit board includes control circuitry coupled with at least one of the first and second sensor elements, wherein the control circuitry is configured to generate tire tread information based on an electrical response of at least one of the first and second sensor elements. The housing includes a housing material that surrounds the circuit board in a direction parallel with respect to a surface of the circuit board. Related methods are also discussed.

A mold for encapsulating a Pin-Fin type power module with resin is disclosed. The power module includes a DBC or IMS, power chips and multiple terminals provided on a first surface of the DBC or IMS and a Pin-Fin structure provided on a second surface of the DBC or IMS. The mold further includes: a cavity for containing the power module; multiple terminal protecting elements corresponding to the terminals, respectively, each for receiving at least a part of a terminal; and an injection hole provided on the bottom of the mold or on the side wall of the mold, The first surface faces the bottom of the mold and the injection hole is below the first surface when the power module is placed in the cavity. A method for manufacturing a power module is also provided.

The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed. The invention also relates to a partial encapsulated electronic component as produced with such a method.

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.