A molding device for producing a molded module. The molding device has one tool part and one further tool part, which together enclose a cavity. At least one of the tool parts has at least one dividing web arranged and configured to subdivide the cavity into at least a low-pressure sub-cavity and a high-pressure sub-cavity. The tool part has at least two feed channels, of which a low-pressure feed channel opens into the low-pressure sub-cavity and has a smaller cross-section at least over a longitudinal portion than a high-pressure feed channel opening into the high-pressure sub-cavity. The low-pressure feed channel is configured to become pressure-resistantly blocked through hardening of the molding compound once a predetermined time interval has elapsed or during the interval. The high-pressure feed channel is configured to conduct a molding pressure into the cavity for a longer time interval than the low-pressure feed channel.

The present invention relates to a press part (1,20,30,40) for supporting a mould part for encapsulating electronic components mounted on a carrier comprising a press block (2, 42), which press block comprises a contact surface (3), a side (4) facing away from the contact surface and at least one side wall (5) connecting the contact surface (3) and the side (4) facing away from the contact surface(3), wherein the press block (2, 42) comprises at least two opposed elements (6a, 6b, 21a, 21b, 31a, 31b, 31c, 31d, 44) protruding from the side wall (5), and wherein the side wall (5) transposes via only a recess (7) into each of the protruding elements (6a, 6b, 21a 21b, 31a 31b, 31c 31d 44). The present invention further relates to a press comprising the press part of the present invention.

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.

Lighting systems are described. A lighting system includes a first lead frame portion and a second lead frame portion. The first lead frame portion has at least a top surface, a bottom surface, and an opening. The second lead frame portion is within the opening of the first lead frame portion and has at least a top surface and a bottom surface. Light-emitting diode (LED) devices are each mechanically and electrically coupled to the top surface of the first lead frame portion and the top surface of the second lead frame portion. An electrically insulating and optically reflective material is disposed over exposed regions of the top surfaces of the first and second lead frame portions.

A method for manufacturing a sensor for a motor vehicle. The method includes placing a sensor core in a lower indentation of a mold; the sensor core having a metal lead frame, including connection pins and lateral retention members, and an integrated circuit, including at least one measurement cell and being overmolded on a support zone of the metal lead frame so the lateral retention members and the connection pins are exposed, and an electrically conductive terminal on each connection pin; placing a magnet in line with the overmolded integrated circuit; placing two lateral indentations of the mold on either side of the magnet and the integrated circuit so the lateral indentations retain the lead frame in the vicinity of the lateral retention members; overmolding the integrated circuit, the magnet and part of the lead frame to allow the free end of the terminals to project; and removing the mold.

A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

In examples, a semiconductor package comprises a substrate and multiple columns of semiconductor dies positioned approximately in parallel along a length of the substrate. The package also includes multiple passive components positioned between the multiple columns of semiconductor dies, the multiple passive components angled between 30 and 60 degrees relative to the length of the substrate, a pair of the multiple passive components having a gap therebetween that is configured to permit mold compound flow through capillary action. The package also includes a mold compound covering the substrate, the multiple columns of semiconductor dies, and the multiple passive components.

A semiconductor module includes a substrate, a semiconductor die arranged on the substrate, at least one first bond wire loop, wherein both ends of the at least one first bond wire loop are arranged on and coupled to a first electrode of the semiconductor die, and a molded body encapsulating the semiconductor die, wherein a top portion of the at least one first bond wire loop is exposed from a first side of the molded body.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.