B29C65/004

Bonding apparatus, bonding system, bonding method and recording medium
11715663 · 2023-08-01 · ·

A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.

MICRONEEDLE-ARRAY MANUFACTURING APPARATUS, MICRONEEDLE-ARRAY MANUFACTURING METHOD, AND PRODUCT HAVING THE MICRONEEDLE ARRAY

A product having a microneedle array is provided wherein the composition distribution has been adjusted with good accuracy. A droplet-delivery apparatus of a microneedle-array manufacturing apparatus is configured capable of delivering, to each recessed part, droplets of a raw-material liquid in a prescribed amount that is less than the capacity of the recessed part. An aligning apparatus can align the relative position of the droplet-delivery apparatus and a mold such that the droplets from the droplet-delivery apparatus are caused to land in each of the recessed parts. The droplet-delivery apparatus delivers a plurality of the droplets to each of the recessed parts; and the aligning apparatus aligns the relative position of the droplet-delivery apparatus and the mold such that a second droplet lands in each of the recessed parts on the center part side of a first droplet.

Connecting insert and an embedding method and a production method therefor

The present disclosure describes a connection insert, in particular a threaded insert, which is embeddable into a formed plastic component. This connection insert comprises a cylindrical main body having a radially outer side, a radially inner side as well as a first and a second axial end, at least one circumferential collar arranged at the radially outer side of the main body which has the largest outer diameter compared to the remaining main body and which is arranged spaced with respect to the first and the second axial end of the main body, and a radially protruding structure arranged at the radially outer side of the main body.

COMPOSITE ARTICLE AND METHOD OF FORMING A COMPOSITE ARTICLE
20210394459 · 2021-12-23 ·

The present disclosure relates to a composite article that may include a plastic component, and a silicone component bonded the plastic component. The plastic component and the silicone component may be bonded at an intersecting region between a first surface of the plastic component and a first surface of the silicone component. The intersecting region may include at least one of an acetone content of not greater than about 0.2 ppm, an MEK content of not greater than about 0.2 ppm, or a trimethylsilanol content of not greater than about 0.2 ppm.

JOINED ARTICLE PRODUCTION METHOD AND JOINED ARTICLE
20210237368 · 2021-08-05 · ·

A production method for a joined object is a method for producing a joined object by joining two objects together. The method includes: irradiating joining surfaces of the respective two objects with plasma; and bonding the joining surfaces irradiated with plasma, at a temperature lower than a melting point of a substance included in the objects.

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND RECORDING MEDIUM
20210272836 · 2021-09-02 ·

A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.

METHOD FOR MANUFACTURING A LEADING EDGE LIMITING AERODYNAMIC DISTURBANCES, A LEADING EDGE OBTAINED FROM THE METHOD AND AERODYNAMIC AIRCRAFT PROFILE COMPRISING SUCH A LEADING EDGE
20210155352 · 2021-05-27 ·

A method for manufacturing a leading edge comprising a structure and at least one outer wall, the manufacturing method comprising a step of mounting of the structure and an assembly step aiming to link the structure and the outer wall during which the outer wall is held pressed against a conformation surface having a profile identical to a theoretical outer surface configured to limit aerodynamic disturbances. This manufacturing method makes it possible to improve the aerodynamic efficiencies of the leading edge thus obtained and of the aerodynamic aircraft profile incorporating same.

Multi-layer films and articles made therefrom

A multilayer film comprising a first layer comprising from greater than 0 to 100 percent by weight of an ethylene/-olefin interpolymer composition (LLDPE), based on the total weight of the film composition; and a second layer comprising at least 5 percent by weight of the second layer, of an anhydride and/or carboxylic acid functionalized ethylene/alpha-olefin interpolymer having a density in the range of from 0.855 to 0.900 g/cm.sup.3; and having a melt index (190 C./2.16 kg) of greater than 200 g/10 min; and from 60 to 95 percent, by weight of the second layer, of EVOH is provided.

Plasticity induced bonding

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.

Microneedle-array manufacturing apparatus, microneedle-array manufacturing method, and product having the microneedle array

A product having a microneedle array is provided wherein the composition distribution has been adjusted with good accuracy. A droplet-delivery apparatus of a microneedle-array manufacturing apparatus is configured capable of delivering, to each recessed part, droplets of a raw-material liquid in a prescribed amount that is less than the capacity of the recessed part. An aligning apparatus can align the relative position of the droplet-delivery apparatus and a mold such that the droplets from the droplet-delivery apparatus are caused to land in each of the recessed parts. The droplet-delivery apparatus delivers a plurality of the droplets to each of the recessed parts; and the aligning apparatus aligns the relative position of the droplet-delivery apparatus and the mold such that a second droplet lands in each of the recessed parts on the center part side of a first droplet.