A film or packaging member for forming a package comprising at least one body and at least one outer adhesive layer, wherein the body and adhesive layer are made of a polyolefin-based plastic, wherein at least the adhesive layer is fusible to be weld to a target surface, and wherein at least the adhesive layer comprises particles that absorb radiation to heat at least a portion of the packaging member.

Embodiments provide methods of assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The methods include coupling the portion of the minor component with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion that is configured to be coupled to the major component with an adhesive. The composition is cured to form the adhesive and the apparel product. The adhesive includes a polymer having a cyclodextrin moiety bonded to an azobenzene moiety.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

The invention relates to a method for welding a connection between a first joining surface of a first molded part and a second joining surface of a second molded part, which by means of a clamping device are moved and braced with their joining surfaces in contact with one another, wherein the first molded part is at least partially transparent for a primary beam of a first radiation source and at least partially absorbent for a secondary beam of a second radiation source, and the second molded part is at least partially absorbent for the primary beam, wherein sequentially the second molded part is irradiated with the primary beam and the first molded part is irradiated with the secondary beam.

A method of welding a sleeve (10) to a tube (20) includes putting onto end portions (11) of the sleeve (10) respective protective elements (40), of a material that cannot be fused with the materials of the sleeve (10) and of the outer coating (24) of the tube (20); applying on each end portion (11) of the sleeve (10) covered by a protective element (40) a respective heat-shrink element (30); supplying each heat-shrink element (30) with a quantity of heat (Q) which by heating it causes it to shrink and compress the respective end portion (11) of the sleeve (10) against the tube (20), where this quantity of heat (Q) is transmitted to the end portion (11) of the sleeve (10) to obtain a welding of the sleeve (10) to the tube (20) and produce a device (1) comprising the tube (20) with the sleeve (10).

The present invention relates to a motor vehicle luminous device including at least one first portion that is transparent to at least one laser beam, the portion having at least one first polymer material, and at least one second portion that absorbs the laser beam and is transparent to at least some of the visible spectrum, including at least one second polymer material, the second portion being laser welded to the first portion.

A method of making a flowcell includes bonding a first surface of an organic solid support to a surface of a first inorganic solid support via a first bonding layer, wherein the organic solid support includes a plurality of elongated cutouts. The method further includes bonding a surface of a second inorganic solid support to a second surface of the organic solid support via a second bonding layer, so as to form the flowcell. The formed flowcell includes a plurality of channels defined by the surface of the first inorganic solid support, the surface of the second inorganic solid support, and walls of the elongated cutouts.

A manufacturing apparatus of a metal-composite patch part and a manufacturing method thereof include: a laser oscillator oscillating a laser; a first laser irradiator used to perform pattern processing on one surface of a metal with a laser by receiving the laser from the laser oscillator; and a metal-composite bonding apparatus for bonding a composite tape to the one surface of the pattern-processed metal. The apparatus includes a feeder roller supplying a composite tape to the one surface of the pattern processed metal and a pressing roller pressing the composite tape to the one surface of the metal. The bonding performance between the metal and the composite and productivity may be improved because the number of the processes related to the metal-composite patch part manufacturing process may be significantly reduced.

A method of making a flowcell includes bonding a first surface of an organic solid support to a surface of a first inorganic solid support via a first bonding layer, wherein the organic solid support includes a plurality of elongated cutouts. The method further includes bonding a surface of a second inorganic solid support to a second surface of the organic solid support via a second bonding layer, so as to form the flowcell. The formed flowcell includes a plurality of channels defined by the surface of the first inorganic solid support, the surface of the second inorganic solid support, and walls of the elongated cutouts.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.